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viscoelastic material model
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  粘弹性
     (2) 、 Using the viscoelastic material model in ADINA program to simulate the dampers with 3D element of eight nodes.
     (2)、利用ADINA大型非线形有限元程序中提供的粘弹性材料模型,将阻尼器部分用8节点三维实体单元来进行模拟。
短句来源
     WLF equation parameters were obtained at reference temperature 105℃ by shifting the creep curve along time logarithm axis. Based on viscoelastic material model, simulation of hot embossing process was carried out.
     基于不同温度的蠕变曲线确定时温等效方程的参数,并基于粘弹性材料模型有限元仿真热压成形.
短句来源
  “viscoelastic material model”译为未确定词的双语例句
     A quasi-static hyperelastic material model is proposed to predict impact behaviors of rubber shock absorbers of bending structures and replace the complicated dynamic viscoelastic material model.
     但是对于受冲击载荷的弯曲型橡胶缓冲器,根据弯曲型结构力学特点,提出采用准静态超弹材料模型替代复杂的超-粘弹动态模型进行有限元数值冲击分析的思路。
短句来源
  相似匹配句对
     Material
     一、实验材料
短句来源
     MATERIAL
     原料
短句来源
     Investigation of Constitutive Relations of Viscoelastic Material
     粘弹性材料本构关系研究
短句来源
     Stress singularity of composite and viscoelastic material
     复合材料和粘弹性材料中的应力奇异性
短句来源
     The Mini-Oscillator Model Research for Viscoelastic Material
     粘弹性材料的微振子模型研究
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  viscoelastic material model
In particular, the nonlinear stress-strain relationship of the material was experimentally measured at various temperatures above the glass transition temperature and the data correlated to a time and strain separable viscoelastic material model.
      
Methodology for Parameter Identification in Nonlinear Viscoelastic Material Model
      
First a direct approach is used where the pressure problem is formulated using the viscoelastic material model.
      
The activities related to material characterization, especially the development of a viscoelastic material model, the characterization of friction between polymer and mold during demolding, the development of an 8-in.
      
First, a direct approach is developed where the pressure problem is formulated using the viscoelastic material model.
      
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Abstract Internal mechanisms and mutual relations ofdynamlc characteristic parameters(dynamicmodulus,damping ratio,etc.)of geotechnlcal materials are probed,in this paper,by using the viscoelastic material models in the mechanics of continuous media.Furthermore,constructive suggestions are presented on how to determine the values of dynamic moduli and structure the dampingmatrix for engineering application.

本文从连续介质力学的粘弹性材料模型出发,探讨了岩土材料的动态弹性模量、阻尼比等动态参数的内在机理及相互之间的关系。此外,在工程应用上,对结构动力分析中的动态弹性模量的取值方法和阻尼矩阵的构造方法提出了建设性的建议。

The mechanism of dynamic elastic modulus (DEM) of geotechnical materials, including rock and concrete, is probed in two repects: firstly, by use of the viscoelastic material model——linear type A, the DEM are probed in three loading ways respectively, which are constant strain rate loading, sine wave loading and sudden loading and secondly, by use of non-linear clastic materials models, the changes in axial natural frequencies of a beam, with a concentrated mass block attached, are probed when...

The mechanism of dynamic elastic modulus (DEM) of geotechnical materials, including rock and concrete, is probed in two repects: firstly, by use of the viscoelastic material model——linear type A, the DEM are probed in three loading ways respectively, which are constant strain rate loading, sine wave loading and sudden loading and secondly, by use of non-linear clastic materials models, the changes in axial natural frequencies of a beam, with a concentrated mass block attached, are probed when oscillation amplitudes are changed. It is shown that the smaller the amplitude, the bigger the natural frequencies, so the bigger the DEM is. That shows that non-linearity is one of the causes of change of DEM. Besides, the implications of the different order DEM are discussed.

本文从两个方面考虑岩土类材料(包括岩石和砼材料)动弹模机理:一是从连续力学的粘弹性材料模型——线性A型出发,分别讨论在不同恒应变率、正弦波激励和突加载三种不同加载方式下所表现出的动态弹性模量;二是从非线弹性(不包括粘性)材料模型出发,讨论非线弹性材料悬梁作轴向振动(前面加集中质量块)时,自振频率随振幅而变化。结果表明:振幅越小,则自振频率越大,从而表现的动弹模越大,这是影响材料动弹模实验结果的重要原因之一。文中还讨论了理想线弹性梁各阶振型动弹模意义。

Temperature, pressure and time are three major control conditions in hot embossing process, and temperature is the most important one. Creep experiments at several temperatures have been conducted to study the mechanical property of PMMA in this paper. General Kelvin model has been used to fit the creep curve of PMMA. The relaxation property was obtained from conversion between creep compliance and relaxation modulus. WLF equation parameters were obtained at reference temperature 105℃ by shifting the creep curve...

Temperature, pressure and time are three major control conditions in hot embossing process, and temperature is the most important one. Creep experiments at several temperatures have been conducted to study the mechanical property of PMMA in this paper. General Kelvin model has been used to fit the creep curve of PMMA. The relaxation property was obtained from conversion between creep compliance and relaxation modulus. WLF equation parameters were obtained at reference temperature 105℃ by shifting the creep curve along time logarithm axis. Based on viscoelastic material model, simulation of hot embossing process was carried out. It is shown that good filling can be obtained at 120℃, and the filling at glass transition temperature represents bad replicative quality. The simulation result is proved by hot embossing experiments.

聚合物微流控芯片的热压成形中,温度、压力和时间是三个主要的工艺参数,其中温度对聚合物的粘弹性影响最大.研究了不同温度下,PMMA材料的蠕变特性,基于广义kelvin蠕变模型拟合材料的蠕变曲线,得到材料的蠕变柔量及延迟时间.根据材料的蠕变柔量与松弛模量推导出松弛模量;基于不同温度的蠕变曲线确定时温等效方程的参数,并基于粘弹性材料模型有限元仿真热压成形.仿真结果表明,热压温度在材料玻璃点以上的120℃进行热压,可以获得良好的结构填充,而在玻璃点温度,热压结构填充性差,图形复制精度差.热压实验表验证了该仿真结论.

 
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