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copper-clad laminate
相关语句
  “copper-clad laminate”译为未确定词的双语例句
     Adhesive-free Type,2 Layer Copper-clad Laminate(CCL)—Gould Flex
     无粘接剂型两层覆铜板(CCL)——Gould Flex
短句来源
     HIGH-BROMINE EPOXY RESIN FOR COPPER-CLAD LAMINATE OF FLAME RETARDANT PAPER SUBSTRATE
     阻燃纸基覆铜板用高溴环氧树脂的研制
短句来源
     Development of Light Colour Phenolic Paper Copper-Clad Laminate
     浅色覆铜箔酚醛纸层压板的研制
短句来源
     This paper introduces a new technics of producing light colour phenolic paper copper-clad laminate and summarizes the main effects on the laminates colour.
     本文介绍了一种生产浅色覆铜箔酚醛纸层压板的工艺 ,总结了影响层压板颜色的因素。
短句来源
     The integrated power module is designed based on aluminum base copper-clad laminate.
     设计了基于铝基板的功率集成模块,对它的散热性能进行了分析;
短句来源
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  相似匹配句对
     Flexible Copper Clad Laminate
     挠性覆铜板
短句来源
     Copper Clad Laminate Technology (Ⅺ)
     覆铜板技术(11)
短句来源
     Copper Clad Laminate Technology (Ⅷ)
     覆铜板技术(8)
短句来源
     Copper Clad Laminate Technology (Ⅳ)
     覆铜板技术(4)
短句来源
     Copper Clad Laminate Technology (Ⅲ)
     覆铜板技术(3)
短句来源
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  copper-clad laminate
The material used is the DuPont? Pyralux? AP 8525R double-sided copper-clad laminate, formed by a Kapton foil with a copper layer on each side.
      


A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates...

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.

介绍了高可靠电镀Ni/Au工艺在PTFE微波印制电路上的应用,并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ni/Au镀层之间附着力的措施。。通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

 
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