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   bond wire 的翻译结果: 查询用时:0.197秒
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bond wire
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  “bond wire”译为未确定词的双语例句
     Including Bond Wire and Pad effects both,detailed performances have also been proposed with NF deterioration to 3.21/3.23 dB,but S parameters change a little after tuning and optimization,finally,the circuit turns out to have outstanding performances.
     完全考虑Bond Wire和Pad效应的性能参数也已经给出,但噪声系数恶化为3.21/3.23dB,S参数在电路调整优化之后变化不大,整体性能比较突出.
短句来源
     The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account .
     分析了变容二极管的等效电路模型,考虑了微带的不连续性、键合引线、通道孔对电路的影响。
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     It is probably that both plastic flow under the pressure of the wedge and wire softening by the ultrasonic vibration enhance the diffusion. After aged at 170 ℃,there are many vacancies and micro-cracks in the bond wire. The reason and their effects on reliability are concerned.
     对键合点进行了老化试验,考察了键合点上25μm直径的质量分数为A l+1%Si引线的组织演变情况,在170℃下,随着老化时间的延长,键合点上引线内部形成了大量的微裂纹和孔洞,连接成线,与超声振动方向平行,分析了产生原因以及对键合点可靠性的影响。
短句来源
     When the aging time is 40 d, the cloud-like structure transforms into rectangular island-like structure and there are many cavities inside the bond wire, which are different from the Kirkendall voids because of the shape and dimension.
     老化40 d时,引线内部出现大量的孔洞并存在方块岛状的Al-Ni组织,其尺寸和 形状显示与Kirkendall孔洞不同。
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     Gold bump bonding process is used for raising bond wire' s pull strength in the domestic ceramics packages obtain very obvious result and it is a preferable newer technique.
     金凸点键合工艺用于提高国产陶瓷外壳键合指 上的键合引线强度有非常明显的效果,是一项较新的技术。
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  相似匹配句对
     Character Analysis of Bond-Wire in IC Package
     IC封装中引线键合互连特性分析
短句来源
     Wire Bond Parameter Optimization in Semiconductor Assembly
     半导体封装超声波压焊的工艺参数优化
短句来源
     Wire frames
     线框造型
短句来源
     Bond and Life
     债券人生
短句来源
     Arbitrage in Bond Market
     国债市场中的套利操作
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  bond wire
In the frequency response (S21) measurements of semiconductor laser diode chips, the test fixture consists of a microwave probe, a submount, and a bond wire.
      
The directly measured impedance of a laser diode is affected strongly by the short bond wire.
      
Optical micrographs indicated that the structure of the devices remains spatially unaltered although the gold bond wire became detached.
      
Study of corrosion phenomena of aluminium bond wire in integrated circuits using several surface- and microanalytical techniques
      
We used double or triple bonds for power and ground to minimize the bond wire inductance.
      
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The paper introduces PHC pipe pile and its requirement for Hi-Bond wire.Thequality gap is pointed out between Hi-Bond wire made in China and those imported.Ideas are given to develop Chinese PC steel bars.

介绍了PHC管桩及其对PC预应力钢棒的要求,指出国产钢棒与进口钢棒的质量差距,提出对发展我国PC预应力钢棒的看法。

In the production practice of a certain plant,it's found that delayed fractureoccurs in one to two coils of PHC Hi-Bond wire every one to two days. Thus somesamples are collected and examined from structure, crystallinity, non-metallicinclusions etc.to approach its delayed fracture reasons.

根据某厂生产实践,发现PHC管桩钢丝产品每1~2天就有1~2盘发生滞后断裂现象,就此搜集了若干例试样,进行组织、晶粒度、非金属夹杂物等项检测,从而探讨其滞后断裂原因。

To introduce the products and equipments such as Hi -Bond wire,low relaxation prestressedsteel wire and strand,cold - rolled - twisted bars, cold -rolled -marked bars,seamless flux cored wire and prestretching equipments for wire rope etc,make an approach to the question of how to make the above-mentioned equipments made in China.

介绍管桩钢筋、低松弛预应力钢丝及钢绞线、冷轧麻花钢筋、冷轧螺纹钢筋、无缝药芯焊丝及钢绳预张拉装置等产品及设备,探讨上述设备的国产化问题。

 
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