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copper plate
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  铜层
    The results showed that: 1. corrosion resistance will be higher when the thickness of the copper plate is 2~8 micron and that of the nickel plate is 15~25 micron with lower current density and lower deposition rate which are within the process limitation;
    实验数据表明:1.在较小的电流密度和较慢的沉积速度(不超过工艺规范中电流密度值)的条件下,镀层厚度以铜层为2~8μm,镍层为15~25μm的防护性能较好;
短句来源
    2. coercive force He varies between 0.01~0.15 Oe as the copper plate thickness increases from 2μ to 37μ;
    2.铜层厚度从2μm增至37μm,其矫顽力Hc值在0.01~0.15奥斯特(Oe)之间变化;
短句来源
    3. no effect of elecroplate thickness has been shown on the holding current, release current or releasing pressure of the product relays when the thicknesses of copper plate and of nickel plate are 1.2~32.0 μ and≤35.0 μ respectively;
    3.铜层厚度在1.2~32.0μm,镍层厚度在35,0μm以下,对继电器的吸动电流、释放电流及复原压力无影响;
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  “copper plate”译为未确定词的双语例句
    The condensation heat transfer properties of water-ethanol binary mixture vapor at atmosphere pressure are experimentally investigated on a coated surface and a smooth copperplate.
    本实验在常压下以乙醇-水二元混合蒸汽为工质,测定低能复合涂层表面和紫铜表面上的冷凝传热特性。 两种表面上冷凝形态随表面自由能差变化有相同的规律,冷凝形态呈现从膜状过渡到滴状的一系列形态。
短句来源
    Nickeltungsten alloy coating was deposited on copper plate making use of electroplating in the bath composed of nickel sulfate, sodium tungstate, and trisodium citrate.
    采用硫酸镍、钨酸钠和柠檬酸三钠为基本组分的镀液,通过电镀的方法在紫铜试片上沉积得到了镍钨合金镀层。
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  copper plate
If this is correct, maintenance of the same copper plate thickness at the meniscus is fundamental to preventing such an occurrence.
      
Most significant was the higher heat flux observed at the meniscus of the outside-radius face, attributable to the locally greater copper plate thickness compared to that of the opposite broad face.
      
The article presents experimental data on the penetration of a thin copper plate into a strip of steel and titanium alloy.
      
For a copper plate, the correspondence is satisfactory.
      
Annealing of the copper plate in flame was found (by XPS and X-ray Auger spectroscopy) to enrich the surface copper layers in oxygen in the forms of Cu2O and adsorbed oxygen.
      
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Process of electroplating on stainless steel was investigated. The adherence of He coating may be strengthen by Pre-Plating an iron plate and a copper plate before silver org old Plating as recommended.

研究了不锈钢上电镀的工艺,提出了在镀银或镀金前先预镀铁和预镀铜的方法以增强镀层结合力.

Investigation was conducted into the effects of electroplate thickness oa the properties of soft magnetic substrate through experimental tests on the products from a large scale production. The results showed that: 1. corrosion resistance will be higher when the thickness of the copper plate is 2~8 micron and that of the nickel plate is 15~25 micron with lower current density and lower deposition rate which are within the process limitation; 2. coercive force He varies between 0.01~0.15 Oe as the...

Investigation was conducted into the effects of electroplate thickness oa the properties of soft magnetic substrate through experimental tests on the products from a large scale production. The results showed that: 1. corrosion resistance will be higher when the thickness of the copper plate is 2~8 micron and that of the nickel plate is 15~25 micron with lower current density and lower deposition rate which are within the process limitation; 2. coercive force He varies between 0.01~0.15 Oe as the copper plate thickness increases from 2μ to 37μ; 3. no effect of elecroplate thickness has been shown on the holding current, release current or releasing pressure of the product relays when the thicknesses of copper plate and of nickel plate are 1.2~32.0 μ and≤35.0 μ respectively; 4. with the thickness of Cu plate being≤ 10μ and of Ni plate being≤ 50μ, no influence is shown on spot welding properties.

以大型电镀槽实际生产出的产品为对象,研究了电镀层厚度对软磁材料性能的影响.实验数据表明:1.在较小的电流密度和较慢的沉积速度(不超过工艺规范中电流密度值)的条件下,镀层厚度以铜层为2~8μm,镍层为15~25μm的防护性能较好;2.铜层厚度从2μm增至37μm,其矫顽力Hc值在0.01~0.15奥斯特(Oe)之间变化;3.铜层厚度在1.2~32.0μm,镍层厚度在35,0μm以下,对继电器的吸动电流、释放电流及复原压力无影响;4.铜层厚度<10μm,镍层厚度<50μm对点焊性能无影响.

Fe-Cu replacement reaction under different conditions were studied.The composition of the deposits were detected by PES and XRD.The results showed that under the normal condition,the products of the replacement were mainly Cu2O.All the reactions in the system were disscussed.Some side reactions can be restrained by adding accelerator W-1.Under the controlled condition,good copper plate has been achieved. The result is of great importance to copper plating industry.

报道了铁置换铜的反应原理,通过光电子能谱测定了镀层的成份及含量,确定了体系中可能发生的全反应和副反应,开辟了一条新的镀铜技术路线。

 
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