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   copper plate 在 金属学及金属工艺 分类中 的翻译结果: 查询用时:0.037秒
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copper plate
相关语句
  铜板
    A discussion about the performance of the Standard piece of T_2 copper plate
    关于T_2铜板标准件性能问题讨论
短句来源
    Reasons for Thermal Crack in Mold Copper Plate And the Countermeasures
    结晶器铜板热裂纹原因及对策
短句来源
    OPTIMIZATION OF FRICTION STIR WELDING PROCEDURE OF COPPERPLATE
    铜板搅拌摩擦焊接工艺优化
短句来源
    Features and application on Ni-Co alloy coating of copper plate for thin slab mould
    薄板坯结晶器铜板组箱式电镀Ni-Co合金镀层特点及应用
短句来源
    Applied Research on Intelligence Fuzzy Control System of the Copperplate Rolling
    铜板轧制智能模糊控制系统的应用研究
短句来源
更多       
  铜板
    A discussion about the performance of the Standard piece of T_2 copper plate
    关于T_2铜板标准件性能问题讨论
短句来源
    Reasons for Thermal Crack in Mold Copper Plate And the Countermeasures
    结晶器铜板热裂纹原因及对策
短句来源
    OPTIMIZATION OF FRICTION STIR WELDING PROCEDURE OF COPPERPLATE
    铜板搅拌摩擦焊接工艺优化
短句来源
    Features and application on Ni-Co alloy coating of copper plate for thin slab mould
    薄板坯结晶器铜板组箱式电镀Ni-Co合金镀层特点及应用
短句来源
    Applied Research on Intelligence Fuzzy Control System of the Copperplate Rolling
    铜板轧制智能模糊控制系统的应用研究
短句来源
更多       
  “copper plate”译为未确定词的双语例句
    Application of the new chemically heat treated copper plate to continuous casting mould
    新型化学热处理连铸结晶器铜壁的应用
短句来源
    Cu element can make crystal grain of alloy finer. The thickness of the intermetallic layers of Sn-Ag-Cu with copper plate is thicker than that of Sn37Pb.
    Cu元素具有细化晶粒作用,Sn-Ag-Cu焊锡与Cu基板的扩散层厚度明显大于Sn37Pb。
短句来源
    1050A aluminum plate, T2 copper plate of 2mm thick are chosen as testing material and machining them with 6 or 9 passes.
    试验中,选取了2mm厚的1050A铝板、T2紫铜板材为研究材料,并对试样分别进行了6或9道次的C2S2变形加工处理。
短句来源
    The results show that Ag、Cu has influence on the solidus temperature, spreading property, electrical conductivity of alloy. The solder shows more favorable combination property as content of Ag is 3% and content of Cu is 2.8%. The thinness of the intermetallic layers of Sn-Ag-Cu with copper plate is thicker than that of Sn37Pb.
    结果表明,Ag、Cu对Sn-Ag-Cu系焊锡合金的熔点、铺展性和电导率都有影响,当Ag质量分数为3%,Cu为2.8%,焊锡合金具有最佳的综合性能,且与铜基板的扩散层厚度大于Sn37Pb。
短句来源
    EFFECTS OF PREHEATING ON GAS TUNGSTEN ARC WELDING OF THICK COPPER PLATE
    预热对紫铜厚板TIG焊接工艺性的影响
短句来源
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  copper plate
If this is correct, maintenance of the same copper plate thickness at the meniscus is fundamental to preventing such an occurrence.
      
Most significant was the higher heat flux observed at the meniscus of the outside-radius face, attributable to the locally greater copper plate thickness compared to that of the opposite broad face.
      
The article presents experimental data on the penetration of a thin copper plate into a strip of steel and titanium alloy.
      
For a copper plate, the correspondence is satisfactory.
      
Annealing of the copper plate in flame was found (by XPS and X-ray Auger spectroscopy) to enrich the surface copper layers in oxygen in the forms of Cu2O and adsorbed oxygen.
      
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This paper discusses the performance of the Standard piece of T_2 copper plate.

本文讨论了T_2铜板标准件的性能问题。

The phosphorus content in copper ball fabricated by rolling or extrusion and then forging, could be controlled, The contents of other impurities could also be controlled below the level stipulated for T1 copper in YB and coincident with that of imports. The ball was available for the production-line of imported printed-circuit board and could be used as the anode in the acidic electroplating bath for bright copper. The effect of the ball was better than that of P-containing copper plate and rod,

文中研制的含磷铜球,不论采用轧制还是挤压后冷锻,其含磷量都可得到控制,其他杂质含量也可控制在YB TI铜标准以下,与进口者基本一致。经在引进的印刷线路板生产流水线上使用,效果与进口铜球一致。还可应用于光亮酸性镀铜工艺中,使用效果优于含磷铜板、棒。

The phosphorus content in copper ball fabricated by rolling or extrusion and then forging, could be controlled. The contents of other impurities could also be controlled below the level stipulated for T1 copper in YB and coincident with that of imports. The ball was available for the production-line of imported printed-circuit board and could be used as the anode in the acidic electroplating bath for bright copper. The effect of the ball was better than that of P-containing copper plate and rod.

文中研制的含磷铜球,不论采用轧制还是挤压后冷锻,其含磷量都可得到控制,其他杂质含量也可控制在YB TI铜标准以下,与进口者基本一致。经在引进的印刷线路板生产流水线上使用,效果与进口铜球一致。还可应用于光亮酸性镀铜工艺中,使用效果优于含磷铜板、棒。

 
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