助手标题  
全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多
查询帮助
意见反馈
   copper plate 在 无线电电子学 分类中 的翻译结果: 查询用时:0.007秒
图标索引 在分类学科中查询
所有学科
无线电电子学
冶金工业
金属学及金属工艺
建筑科学与工程
自动化技术
图书情报与数字图书馆
考古
无机化工
更多类别查询

图标索引 历史查询
 

copper plate
相关语句
  铜板
    Study on the High Electric Property of Modified Epoxy Copperplate
    改性环氧覆铜板高电性能的研究
短句来源
    This paper studies method of high electric property of epoxy copperplate,discuss the way to get high electric property copperplate and analyzes the properties of copperplate of epoxy modified with MPPO.
    目的 :研究高电性能环氧覆铜板的方法。 方法 :论述获得高电性能覆铜板途径 ,分析改性聚苯醚应用于改性环氧得到的覆铜板的性能。
短句来源
    The results show the copperplate of epoxy modified with MPPO has excellent electric properties.
    结果 :用改性聚苯醚改性环氧而得的覆铜板具有优异的电性能
短句来源
    The angles of the contact of coating surface and copper plate were measured, and the frost layer thickness on coating surface was measured and compared with that on copper plate surface in different experimental conditions.
    用接触角测量仪测出涂层表面和紫铜板表面的接触角,在不同实验条件下测量了涂层表面霜层的厚度,并与紫铜表面的霜厚进行了对比。
短句来源
    To presents the methods of designing and making circuit board for experimental teach-ing by computer,laser printer and heating roller,which are the methods of designing and making printed circuit board on one-side copper plate and the circuit drawing,on insulated epoxyresin base.
    介绍了利用计算机、激光打印机和制板机设计制作实验教学电路板的方法. 即在单面覆铜板的铜面设计制作印制电路板熏在绝缘玻纤环氧树脂基面设计制作电路原理图.
短句来源
  “copper plate”译为未确定词的双语例句
    Frequency sweeping method is applied to determineQ-value with different dielectric rods of 8 mm in diameter inserted inside the applicator, with different size and thickness copper plate iris. Influence of the above factors have been discussed theoretically.
    采用扫频法测量,并从理论上讨论了在谐振腔中分别插入直径为8mm的不同棒状介质后,以及不同孔径、不同厚度耦合膜片对Q值的影响。
短句来源
查询“copper plate”译词为用户自定义的双语例句

    我想查看译文中含有:的双语例句
例句
为了更好的帮助您理解掌握查询词或其译词在地道英语中的实际用法,我们为您准备了出自英文原文的大量英语例句,供您参考。
  copper plate
If this is correct, maintenance of the same copper plate thickness at the meniscus is fundamental to preventing such an occurrence.
      
Most significant was the higher heat flux observed at the meniscus of the outside-radius face, attributable to the locally greater copper plate thickness compared to that of the opposite broad face.
      
The article presents experimental data on the penetration of a thin copper plate into a strip of steel and titanium alloy.
      
For a copper plate, the correspondence is satisfactory.
      
Annealing of the copper plate in flame was found (by XPS and X-ray Auger spectroscopy) to enrich the surface copper layers in oxygen in the forms of Cu2O and adsorbed oxygen.
      
更多          


In this article cowper pouder is used as fiIler of conductive adhesiv,printed circuit board is made by screen printing,and conventional ctched technology of covering copper plate is inproved. The resarh on new technology of plat ed makin8 scrreen printing solidification and electroplate also related the printed circuit board has been tested and the index has come to or exceed the technical requirements of that odf covering copper board. This printed circuit board can be used in the making of middle...

In this article cowper pouder is used as fiIler of conductive adhesiv,printed circuit board is made by screen printing,and conventional ctched technology of covering copper plate is inproved. The resarh on new technology of plat ed makin8 scrreen printing solidification and electroplate also related the printed circuit board has been tested and the index has come to or exceed the technical requirements of that odf covering copper board. This printed circuit board can be used in the making of middle or low grade electrical equipment.

本文采用铜导电股,用丝网漏印法制印刷线路板,对传统的覆铜板腐蚀工艺进行改进,对制板、丝网漏印、固化、电镀等新工艺进行研究,所制作的印刷线路板经测试其性能指标已达到或超过覆铜板印刷线路板的技术要求,这种线路板可用在中低档电器的制作。

TE103 resonator is the single-mode applicator adopted most widely in microwave sintering system. Quality factor Q-value reflects the sharpness of response excited by outside. Frequency sweeping method is applied to determineQ-value with different dielectric rods of 8 mm in diameter inserted inside the applicator, with different size and thickness copper plate iris. Influence of the above factors have been discussed theoretically.

TE103单模腔是微波烧结系统中应用最广泛的单模谐振腔,品质因数Q值是度量腔体对外部激励响应的尖锐程度,是对烧结影响最大的谐振腔基本参量。采用扫频法测量,并从理论上讨论了在谐振腔中分别插入直径为8mm的不同棒状介质后,以及不同孔径、不同厚度耦合膜片对Q值的影响。

Metallization is necessary for some packaging substrates. It is the key of metallization to improve the adhesion strength between copper plate and ceramic substrates. The adhesion between copper plate and ceramic substrates generally should be more than 15 MPa. Electroplated copper on alumina and aluminum nitride substrates has been studied. It is found that the roughening surface of the substrates can improve the adhesion. The technology of depositing copper plate and the testing methods...

Metallization is necessary for some packaging substrates. It is the key of metallization to improve the adhesion strength between copper plate and ceramic substrates. The adhesion between copper plate and ceramic substrates generally should be more than 15 MPa. Electroplated copper on alumina and aluminum nitride substrates has been studied. It is found that the roughening surface of the substrates can improve the adhesion. The technology of depositing copper plate and the testing methods of adhesion are also studied.

为提高封装基板铜导体层与陶瓷基板的结合强度,研究了在氧化铝和氮化铝的基板上进行化学镀铜,对表面进行粗化和改性,经过优化工艺条件后,氧化铝与镀层的结合强度可以达到27 MPa,氮化铝与镀层的结合强度可以达到22 MPa。

 
<< 更多相关文摘    
图标索引 相关查询

 


 
CNKI小工具
在英文学术搜索中查有关copper plate的内容
在知识搜索中查有关copper plate的内容
在数字搜索中查有关copper plate的内容
在概念知识元中查有关copper plate的内容
在学术趋势中查有关copper plate的内容
 
 

CNKI主页设CNKI翻译助手为主页 | 收藏CNKI翻译助手 | 广告服务 | 英文学术搜索
版权图标  2008 CNKI-中国知网
京ICP证040431号 互联网出版许可证 新出网证(京)字008号
北京市公安局海淀分局 备案号:110 1081725
版权图标 2008中国知网(cnki) 中国学术期刊(光盘版)电子杂志社