助手标题  
全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多
查询帮助
意见反馈
   solder joint reliability 的翻译结果: 查询用时:0.189秒
图标索引 在分类学科中查询
所有学科
无线电电子学
金属学及金属工艺
更多类别查询

图标索引 历史查询
 

solder joint reliability
相关语句
  焊点可靠性
     Effect of Lanthanum on Driving Force for Cu_6Sn_5 Growth and Improvement of Solder Joint Reliability
     镧对Cu_6Sn_5长大驱动力及焊点可靠性的影响
短句来源
     The Theory and Experiment Researches about The Solder Joint Reliability on PCB
     PCB焊点可靠性问题的理论和实验研究进展
短句来源
     Automatic Management System of Solder Joint Reliability in Reflow Soldering
     再流焊焊点可靠性自动管理系统
短句来源
     Overview on Solder Joint Reliability in Micro-jointing
     微连接焊点可靠性的研究现状
短句来源
     On the basis of virtual evolving technology of surface mount technology (SMT) for the solder joints, Design For Manufacturing (DFM) is employed, and DFM-oriented SMT virtual assembly system targeted at assembly quality and solder joint reliability is developed.
     在表面组装技术焊点虚拟成形技术的基础上,运用面向制造的设计思想,以表面组装技术组装质量与焊点可靠性为目标,研究面向表面组装技术生产组装工艺设计的产品虚拟组装系统。
短句来源
更多       
  焊接可靠性
     Impact of Reflow Parameter on Solder Joint Reliability
     再流区工艺参数对焊接可靠性的影响
短句来源
     The influence factors of solder joint reliability and the influence of composition on performance of lead-free solder are analyzed,the harvests and the selection principles of lead-free solder in the foreign country are introduced
     本文分析了影响焊接可靠性的因素及组分元素对无铅焊料的性能影响,并介绍了无铅焊料的研究成果及其选择 原则。
短句来源
  “solder joint reliability”译为未确定词的双语例句
     Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability
     陶瓷阵列封装的两种形式及其接头可靠性
短句来源
     Base on the theory of heat exchange, thermal elasticity mechanics and structural optimization, this paper presents a thermo-mechanical analysis of a plastic ball grid array (PBGA) package design, with emphasis on the package warpage, thermally induced stress and the second of level solder joint reliability.
     本文基于热传导、热弹性力学和结构优化理论,针对典型的PB6A封装体采用了热一结构数值模拟,重点对其热变形、热应力以及焊点的可靠性进行了分析。
短句来源
     In this paper, a thermal-mechanical analysis of a multi-chip packaging module is presented, with emphasis on the package warpage, thermally induced stress and the solder joint reliability.
     本文针对典型的多芯片MCM模块,建立了三维有限元数值分析模型。 研究了多芯片MCM模块的残余应力与翘曲变形,分析了相关的几何参数对残余应力以及翘曲变形的影响,讨论了MCM结构中焊点的疲劳失效问题。
短句来源
     An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.
     研制了一种用于SMT软钎焊接头热循环可靠性试验的热循环发生装置和一种SMT模拟陶瓷芯片载体,用该热循环装置、模拟芯片载体和统计学方法研究了芯片载体金属化镀层对SMT软钎焊接头热循环可靠性的影响。
短句来源
     The primary issue of SMT solder joint reliability is the creep fatigue failure due to the coefficient of thermal expansion (CTE) mismatch between the ceramic chip carrier and the substrate material under the thermal cycle.
     SMT焊点的可靠性问题主要是焊点在热循环过程中 ,由于陶瓷芯片载体与基板材料之间的热膨胀失配而导致焊点的蠕变疲劳失效。
短句来源
更多       
查询“solder joint reliability”译词为用户自定义的双语例句

    我想查看译文中含有:的双语例句
例句
为了更好的帮助您理解掌握查询词或其译词在地道英语中的实际用法,我们为您准备了出自英文原文的大量英语例句,供您参考。
  solder joint reliability
Shrinkage effects have been reported in Sn/Pb, Sn/Pb/Ag, Sn/Ag/Cu, and Sn/Cu/Ni solders for various components, but few studies have examined their impact on solder joint reliability.
      
This paper is concerned with the mechanics of interfacial fracture that are active in two common testing configurations of solder joint reliability.
      
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials
      
Metallurgical reactions between solders and under bump metallization (UBM) are key issues for the solder joint reliability in microelectronic packaging.
      
Solid-state intermetallic compound (IMC) growth behavior plays and important role in solder joint reliability of electronic packaging assemblies.
      
更多          


An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.

研制了一种用于SMT软钎焊接头热循环可靠性试验的热循环发生装置和一种SMT模拟陶瓷芯片载体,用该热循环装置、模拟芯片载体和统计学方法研究了芯片载体金属化镀层对SMT软钎焊接头热循环可靠性的影响。

In Surface Mount Technology (SMT), the solder joint serves as both the electrical and mechanical interface between the Surface Mount Component and Printed Circuit Board. Thus the reliability of the solder joint is one of the most critical issues in SMT development. In this paper, some experimental methods which have been used for the reliability study of solder joint are summarized. A complementary approach, which combines the technique of Real Time Holographic Interferometry (RTH) and the technique of Moiré...

In Surface Mount Technology (SMT), the solder joint serves as both the electrical and mechanical interface between the Surface Mount Component and Printed Circuit Board. Thus the reliability of the solder joint is one of the most critical issues in SMT development. In this paper, some experimental methods which have been used for the reliability study of solder joint are summarized. A complementary approach, which combines the technique of Real Time Holographic Interferometry (RTH) and the technique of Moiré Interferometry (MI) for three dimensional displacement measurement of Surface Mount Assembly are introduced. It is expected that some new experimental techniques, with the high frequency grating or even the super high frequency grating, Micro Moiré Measurement method and the Heterodyne Holographic Interferometry, etc., will be developed in the study of solder joint reliability.

在表面安装技术中,焊点既起电气连接作用又起机械连接作用,所以焊点的可靠性问题是人们长期关注的最关键问题之.本文对解决焊点可靠性问题的不同实验测试方法的研究现状与进展进行了回顾与总结,并对实时全息干涉度量和云纹干涉实验系统及研究方法进行了介绍.在此基础上,对焊点的可靠性问题的实验研究进行了展望

The potential energy controlling equation for SnPb solder joint geometry was investigated, and the solder joint geometry with duplicate SnPb solders in flip chip technology was simulated by Surface Evolver. Based on the unified viscoplastic Anand constitutive equation, the viscoplastic deformation behavior of SnPb solder was described. The stress and strain distributions in duplex SnPb solder joint during thermal cycle were studied by finite element method, the thermal cycle life of duplex SnPb solder joint...

The potential energy controlling equation for SnPb solder joint geometry was investigated, and the solder joint geometry with duplicate SnPb solders in flip chip technology was simulated by Surface Evolver. Based on the unified viscoplastic Anand constitutive equation, the viscoplastic deformation behavior of SnPb solder was described. The stress and strain distributions in duplex SnPb solder joint during thermal cycle were studied by finite element method, the thermal cycle life of duplex SnPb solder joint was predicted based on Coffin--Manson equation. The solder joint geometry with duplicate SnPb solders was linked with the solder joint reliability. There exists a direct relationship between stand-off height and thermal cycle life of solder joint with duplicate SnPb solders and a regression model was carried out.

建立了复合焊点形态的能量控制方程,采用 Surface Evolver软件模拟了复合 SnPb焊点(高 Pb焊料凸点,共晶 SnPb焊料圆角)的形态利用复合 SnPb焊点形态的计算结果,采用统一型粘塑性 Anand本构方程描述复合焊点 Pb90Sn10和 Sn60Pb40的粘塑性力学行为,采用非线性有限元方法分析复合 SnPb焊点在热循环条件下的应力应变过程。基于 Coffin—Manson经验方程预测焊点的热循环寿命,考察焊点形态对焊点可靠性的影响,研究了复合 SnPb焊点间隙和焊点的热循环寿命之间的关系

 
<< 更多相关文摘    
图标索引 相关查询

 


 
CNKI小工具
在英文学术搜索中查有关solder joint reliability的内容
在知识搜索中查有关solder joint reliability的内容
在数字搜索中查有关solder joint reliability的内容
在概念知识元中查有关solder joint reliability的内容
在学术趋势中查有关solder joint reliability的内容
 
 

CNKI主页设CNKI翻译助手为主页 | 收藏CNKI翻译助手 | 广告服务 | 英文学术搜索
版权图标  2008 CNKI-中国知网
京ICP证040431号 互联网出版许可证 新出网证(京)字008号
北京市公安局海淀分局 备案号:110 1081725
版权图标 2008中国知网(cnki) 中国学术期刊(光盘版)电子杂志社