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copper-clad laminates
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  “copper-clad laminates”译为未确定词的双语例句
     JIS C 6471-1995 Test Method of Copper-Clad Laminates for Flexible Printed Wiring Boards
     JIS C 6471-1995挠性印制线路板用覆铜板试验方法
短句来源
     Study on Improving the Joint Quality of Reflow Soldering for Large Dimension Copper-Clad Laminates
     提高大面积敷铜箔板再流焊接质量的研究
短句来源
     The properties of copper-clad laminates (CEM-3) made from A80/BPFN/2-MZ had achieved the industry standard (IPC-4101) and BPFN would replace PN as a curingagent for A80 in fabricating CEM-3 copper-clad laminates.
     依据覆铜板行业IPC-410l标准对以A80/BPFN为基体制备的CEM-3覆铜版进行了全面性能测试,各项性能指标均达到标准要求,已在CEM-3覆铜板产品中通过了中试。
短句来源
     Study on Formula of New Copper Foil Adhesive for Copper-Clad Laminates
     覆铜箔层压板用新型铜箔胶粘剂配方的研究
短句来源
     Copper Foil Adhesives for Paper Base Copper-Clad Laminates
     纸基覆铜箔板专用胶粘剂的研究
短句来源
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  相似匹配句对
     Study on new type polyimide copper clad laminates
     新型聚酰亚胺覆铜板的研制
     The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates
     覆铜箔层压板专用环氧树脂的合成与性能
短句来源
     The Present Situation of Manufacturing Copper Clad Laminates With UV-block
     紫外光屏蔽覆铜板de生产现状
短句来源
     Copper Foil Adhesives for Paper Base Copper-Clad Laminates
     纸基覆铜箔板专用胶粘剂的研究
短句来源
     Preparation of Copper Clad Laminates Based on Polytetrafluoroethylene with Blending Modification
     共混改性聚四氟乙烯覆铜板的制备
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A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates...

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.

介绍了高可靠电镀Ni/Au工艺在PTFE微波印制电路上的应用,并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ni/Au镀层之间附着力的措施。。通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

 
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