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epoxy-terminated
相关语句
  环氧端基
     STUDIES ON COMPOSITE OF EPOXY-TERMINATED POLYETHER KETONE/EPOXY RESIN
     环氧端基聚芳醚酮/环氧树脂复合体系的研究
短句来源
     STUDIES ON COMPOSITE OF EPOXY-TERMINATED POLYETHER SULFONE/EPOXY RESIN
     环氧端基聚芳醚砜/环氧树脂复合体系的研究
短句来源
     SYNTHESIS AND CHARACTERIZATION OF A NOVEL EPOXY-TERMINATED POLY(ARYL ETHER SULFONE)
     新型环氧端基聚芳醚砜的合成及表征
短句来源
     Epoxy-terminated phenolphthalein poly (cyanoarylether) (E -- PCE) was intermixed with AG - 80epoxy resin, then were cured by DDS, The full corsslinked samples were analysed by DSC and TGA, As a result, the heat - resistance of epoxy resin was enhanced by E -- PCE resin.
     将环氧端基酚酞聚芳醚腈(简称E-PCE树脂)与环氧树脂进行共混固化,固化后树脂经DSC、TGA分析,结果表明E-PCE树脂可提高环氧树脂耐高温性能。
短句来源
     The microstructure and thermo-mechanical properties of epoxy-terminated polyether sulfone (E-PPES)/E-44/DDM composite systems were investigated, and the toughing mechanism of E-PPES in epoxy resin was discussed.
     研究了含二氮杂萘酮结构环氧端基聚芳醚砜(E-PPES)/E-44环氧树脂复合体系的微观结构和热-力学性能。 分析了E-PPES在环氧树脂基体中的增韧机理。
短句来源
  “epoxy-terminated”译为未确定词的双语例句
     l. Epoxy-terminated poly(aryl ether sulfone ketone) (E-PPESK) was synthesized by the reaction of epichlorohydrin with PPESK oligomer prepared by nucleophilic substitution of 4,4'-dichloro-benzosulfone and 4,4'-difluorobenzophenone with 4-(4-hydroxypheny)-2,3-phthalazin-l-one.
     1.以4-4’-二氯二苯砜(DCS)、4-4’-二氟二苯酮(DFK)和4-(4-羟基苯基)-2,3二氮杂萘-1-酮(DHPZ)为原料通过亲核取代反应合成了PPESK预聚体。
短句来源
     EPOXY-TERMINATED PHENOLPHTHALEIN POLYARYL-ETHERKETONE:SYNTHESIS AND CHARACTERIZATION
     含环氧端基酚酞聚芳醚酮E-PEK的合成及表征
短句来源
     Modification of Epoxy Molding Compounds with Epoxy-terminated Polydimethylsiloxane
     端环氧基聚硅氧烷对环氧模塑料的改性
短句来源
     Development of Epoxy-terminated Phenolphthalein Poly (cyanoarylether)
     含环氧端基酚酞聚芳醚腈的研制
短句来源
     Properties Prediction of a Composite Based on Epoxy-terminated Poly (phenylene ether ketone)
     环氧封端聚芳醚酮复合材料的性能预测
短句来源
更多       
  相似匹配句对
     SOLVENTLESS EPOXY PAINT
     第六章 无溶剂型环氧涂料
短句来源
     Epoxy Tooling by Stereolithography
     基于光固化原型的环氧树脂制模技术
短句来源
     (4) epoxy-resin.
     ④环氧树脂。
短句来源
     PROGRESS OF EPOXY-NANOCOMPOSITES
     环氧树脂基纳米复合材料研究进展
短句来源
     SYNTHESIS OF HYDROXYL-TERMINATED POLYSTYRENE
     双端羟基聚苯乙烯的合成
短句来源
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  epoxy-terminated
Studies on the Synthesis and the Reaction Mechanism of Epoxy-Terminated Polystyrene Oligomer
      
Epoxy-terminated phenolphthalein poly(ether ether ketone)s (E-PEKs) of number average molecular weights from 1,200 to 8,400 were cured with 4,4'-diaminodiphenylether (DDE).
      
Epoxy-terminated phenolphthalein poly(ether ether ketone) reactive oligomers: cure with 4,4'-diaminodiphenylether
      


Epoxy-terminated phenolphthalein polyaryletherketones (E-PEK) of M_n=1000~8000 were synthesized by reaction of epichhlorohydrin with PEK oligomer having—OK terminal groups prepared by condensation of phenolphthalein (PPH) with 4,4'-dichlorobenzophenone (DCBP) at molar ratios of PPH to DCBP from 1:0. 5 to 1:0. 9. The E-PEKs were characterized by IR and ~1H NMR spectra,initial glass transtion temperature (T_(gi)); the melting viscosity and solubility of E-PEK samples were also measured. The E-PEKs were cured...

Epoxy-terminated phenolphthalein polyaryletherketones (E-PEK) of M_n=1000~8000 were synthesized by reaction of epichhlorohydrin with PEK oligomer having—OK terminal groups prepared by condensation of phenolphthalein (PPH) with 4,4'-dichlorobenzophenone (DCBP) at molar ratios of PPH to DCBP from 1:0. 5 to 1:0. 9. The E-PEKs were characterized by IR and ~1H NMR spectra,initial glass transtion temperature (T_(gi)); the melting viscosity and solubility of E-PEK samples were also measured. The E-PEKs were cured with 4, 4'-diaminodiphenylether (DDE) and the glass transition temperatures of the fully erosslinked E-PEK/DDE (T_(g∞)) were found to be in relation with the initial molecular weight of the oligomer. The T_(g∞) values for all samples closslinked were in the range of 183~215℃.

由酚酞和4,4′-二氯二苯酮经亲核缩聚制得了一系列不同分子量的含—OK端基的聚醚酮低聚物,将其与环氧氯丙烷反应得到了分子量为1000~8000的含环氧端基聚芳醚酮(E-PEK)。用IR和~1H NMR表征了E-PEK的分子链结构,测定了T_g、溶解性和熔融粘度。研究了E-PEK/DDE体系的固化,固化后树脂的T_(g∞)=183~215℃,与低聚物的初始分子量有关。

Epoxy-terminated poly (arylene ether sulphone) and allyl-terminated poly (arylene ether sulphone) were prepared via hydroxyl-terminated oligomers under phase transfer catalyzed reaction conditions. The products were characterized by FT-IR. 'H-NMR and elemental analysis.

SYNTHESISANDCHARACTERIZATIONOFEPOXYANDALLYL-TERMINATEDPOLY(ARYLENEETHERSULPHONE)¥LianLaiZHANG;YiGU;LuXiaJIANG;XingXianCAI(Dep...

This paper concerns with lowering the internal stress of epoxy molding com-pounds by incorporation of epoxy-terminated polydimethylsiloxanes. When the modifier wasblended with epoxy resin and novolac resin curing agent directly,surface bleeding of thepolysiloxane occurred.When the polysiloxane was first prereacted with the novolac resin toform a block copolymer and then blended with the epoxy resin,the polysiloxane bleedingwas prevented,the polysiloxane phase was smaller in size and the domain distribution...

This paper concerns with lowering the internal stress of epoxy molding com-pounds by incorporation of epoxy-terminated polydimethylsiloxanes. When the modifier wasblended with epoxy resin and novolac resin curing agent directly,surface bleeding of thepolysiloxane occurred.When the polysiloxane was first prereacted with the novolac resin toform a block copolymer and then blended with the epoxy resin,the polysiloxane bleedingwas prevented,the polysiloxane phase was smaller in size and the domain distribution in theresin matrix was more even.The main factors influencing the internal stress were investigat-ed. It was found that the domain size of the polysiloxane phase depended on the syntheticconditions of the copolymers,the length of polysiloxane chain and the content of polysilox-ane in the cured resin.The flexural modulus of the epoxy molding compounds dependedmainly on the interface area between the polysiloxane phase and the resin matrix, while thethermal expansion coefficient below Tg was dependent not only on the interface area betweenthe two phases,but also on the interaction between the resin/filler matrix and polysiloxanephase to a great extent.

研究引入端环氧基聚硅氧烷对环氧封装材料的低应力化作用。将聚硅氧烷直接与环氧树脂及固化剂共混,由于聚硅氧烷不能完全键合到树脂基体上,模塑料出现表面渗油,将端环氧基聚二甲基硅氧烷首先与环氧树脂的固化剂─—酚醛树脂预反应形成嵌段共聚物,然后再与环氧树脂混合,解决了渗油,使聚硅氧烷在环氧树脂中的分布更均匀,相区尺寸更小。在环氧树脂固化物中,聚硅氧烷微区尺寸依赖于预反应条件、聚硅氧烷肤段链长和聚硅氧烷含量。环氧模塑料的模量主要决定于聚硅氧烷与树脂基体二相间的界面面积;而玻璃态的线性热膨胀系数不仅与二相间的界面积有关,并在很大程度上取决于树脂/填料基体与聚硅氧烷相的相互作用。

 
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