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   copper-clad 的翻译结果: 查询用时:0.007秒
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copper-clad
相关语句
  铜包
     New Process of Deoxidized Copper-clad Iron Wire
     脱氧铜包铁线生产新工艺
短句来源
     Copper-clad Steel Wire──A Kind of Complex Material of Wide Usage
     铜包钢丝──一种用途广泛的复合材料
短句来源
     To sum up the production method of copper-clad steel wire,analyze the problems existed in domestic production,introduce the standard and application of products.
     概述铜包钢丝的生产方法,分析国内生产存在的问题,介绍产品标准及其应用。
短句来源
  “copper-clad”译为未确定词的双语例句
     JIS C 6471-1995 Test Method of Copper-Clad Laminates for Flexible Printed Wiring Boards
     JIS C 6471-1995挠性印制线路板用覆铜板试验方法
短句来源
     The experiment indicates that the apparent temperature sensitivity of the copper-clad and the aluminium-clad FBG temperature sensors are separately enhanced to 34.3pm/℃ and 42.7pm/℃,the measurement reproducibility is 2.3pm and 2.8pm rospectively,when the temperature change is from 20℃ to (80℃.)
     实验表明:当温度从20℃升至80℃时,Cu制和Al制铠装FBG温度传感器的表观温度灵敏度分别约提高34. 3, 42. 7pm/℃,测量重复性分别为2. 3, 2. 8pm。
短句来源
     The Electric Conductivity Physics Model and Plating Thickness Calculation of Copper-clad Steel Wire
     铜包钢线导电性物理模型及镀层厚度计算
短句来源
     The properties of copper-clad laminates (CEM-3) made from A80/BPFN/2-MZ had achieved the industry standard (IPC-4101) and BPFN would replace PN as a curingagent for A80 in fabricating CEM-3 copper-clad laminates.
     依据覆铜板行业IPC-410l标准对以A80/BPFN为基体制备的CEM-3覆铜版进行了全面性能测试,各项性能指标均达到标准要求,已在CEM-3覆铜板产品中通过了中试。
短句来源
     By studying the filling which can adjust dielectric constant, the equality of dielectric thickness andcopper board preparation technics , have developped high frequency circuit using copper-clad copper base boardwhose dielectric constant is 6.15 and dissipation factor is 0.0015.
     通过对可调节介电常数的填充材料、介质厚度均匀性、铜板处理工艺的研究与选择,研制开发出了介电常数为6.15、介质损耗因数为0.0015的铜基高频电路用覆铜板。
短句来源
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  相似匹配句对
     Flexible Copper Clad Laminate
     挠性覆铜板
短句来源
     COPPER
     铜
短句来源
     Copper Clad Laminate Technology (Ⅺ)
     覆铜板技术(11)
短句来源
     Production & Application of Copper-Clad Steel Wire
     铜包钢线的生产工艺及其应用
短句来源
     New Process of Deoxidized Copper-clad Iron Wire
     脱氧铜包铁线生产新工艺
短句来源
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  copper-clad
The reliability and integrity of pre-tinned copper-clad printed circuit (PC) boards are serious concerns in the manufacture of electronic devices.
      
Copper-graphite materials with copper-clad graphite granule additions
      
The electrical resistivity of composites containing copper-clad graphite granules is much less than that of composites with bare graphite.
      
Effect of copper-clad graphite on the properties of iron base sintered materials
      
Copper-graphite materials with copper-clad graphite granule additions
      
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The dynamic stability in CVD Nb3Sn superconducting tapes has been studied both theoretically and experimentally. In consideration of a twodimensional model, the stability criterion has been found to bewhere ηis the volume fraction of the superconductor, ω is a parameter eharacteriging the superconducting tape geometry and the cooling condition. Using the above criterion, we show that there exists a optimum copper-clad thickness, which have maximum of the overall critical current density. This thickness...

The dynamic stability in CVD Nb3Sn superconducting tapes has been studied both theoretically and experimentally. In consideration of a twodimensional model, the stability criterion has been found to bewhere ηis the volume fraction of the superconductor, ω is a parameter eharacteriging the superconducting tape geometry and the cooling condition. Using the above criterion, we show that there exists a optimum copper-clad thickness, which have maximum of the overall critical current density. This thickness is determined by expressionwhere ξ is the ratio of the thickness of the matrix to that of the superconductor. We have discussed the effects of the conductor geometry, thickness of copper-clothing dcu, condition of cooling, applied magnetic field and transport current on the stability. With dcu reaching a certain value, a transition is made from dynamic stability to cryostatic stability. The theory is in good agreement with the results of the experiments by using simulation coils.

从理论和实验上研究了CVD Nb_3Sn超导带的动态稳定性.基于二维平板模型,给出了稳定性判据,式中η为超导体所占的体积分数,ω为表征超导带几何尺寸和所处冷却条件的传热参量.应用上述判据,可证明存在一个使超导带具有最大全电流密度的最佳敷铜厚度.最佳敷铜厚度由公式所确定,其中ξ为基体与Nb_3Sn层厚度之比.讨论了导体尺寸、敷铜厚度、冷却条件以及外磁场和传输电流的大小等因素对稳定性的影响.并且得出当敷铜厚度达到某一确定值时,就由动态稳定过渡到全稳定.采用模拟线圈所作的实验研究表明,理论和实验结果符合较好.

The configuration features of copper clad NbTi wires with 1, 55, 3025 and 6655 filaments by hydrostatic extrusion (HE) have been investigated. The results have been compared with those of the products by hot common extrusion, showing that the configuration of NbTi superconducting material produced by HE is much better than that by common processes. Moreover, HE is found to have less geometrical loss of material. Experiments prove that NbTi superconducting wires with extrafine multifila-ments (filament diameter...

The configuration features of copper clad NbTi wires with 1, 55, 3025 and 6655 filaments by hydrostatic extrusion (HE) have been investigated. The results have been compared with those of the products by hot common extrusion, showing that the configuration of NbTi superconducting material produced by HE is much better than that by common processes. Moreover, HE is found to have less geometrical loss of material. Experiments prove that NbTi superconducting wires with extrafine multifila-ments (filament diameter < 1μm) can be obtained by HE.

本文探讨了用350吨静液挤压机加工的铌钛复铜单芯棒、55芯、3025芯及三元6655芯复合超导体的几何形状、芯线沿横断面及轴向分布情况.得出:用静液挤压法生产的Nb-Ti超导复合线,其质量超过一般加工工艺的,挤压时的几何损失少,较一般工艺成材率高.并得出,用静液挤压法加工多芯极细芯(<1μm)Nb-Ti超导复合线是可能的.

This paper introduced the research about the micro structure and the properties of the surface layer and the ferronickel core-copper clad boundary layer of dumet wire by means of AES、WDS and x-ray diffraction. The results show that the good surface layer consisting of a mixture of Cu2O and noncrystalline borax;The wettability between the glass and dumet wire depends on both the cleanliness and constitution of surface layer and the heating conditions.

利用AES、WDS和x-射线衍射等方法,研究了杜美丝表面层、铁镍芯与覆铜层界面的微观结构与特性。结果表明:良好的表面层应由Cu2O和非晶态的硼砂构成;玻璃与杜美丝的润湿性决定于表面层的净化程度和构成及加热条件。

 
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