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the parameter of bonding
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     estimation of its parameter;
     评定运动模糊的参数;
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     and b was empirical parameter.
     b为经验常数。
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     n—Parameter CAPM
     n个参数的资本性资产定价模型
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     On Lode parameter of plasticits
     关于塑性力学中的Lode参数
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     THE NUCLEAR TEMPERATURE PARAMETER
     核反应过程中的核温度参量
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Making a sucess of gold wire thermosonic ball bonding in hybrid integrated circuit must be:correct function adjustment of bonding machine,selecting suitable bonding tools and material.The parameters of bonding are normalized in practice,and the analysis of various phenomena in the bonding process is given.Development of these work is of benefit to raising quality of gold wire ball bonding.

本文论述了金丝超声热压球焊在混合集成电路焊接中取得成功必须注意:对焊机功能的正确调整,选取合适的焊接工具和材料.在实践中规范焊接参数,并给出了焊接中各种现象的分析.这些工作的开展有利于提高金丝球焊的焊接质量.

Based on the infrared transmission theory, an IR-detecting instrument for testing waferbonding quality were framed. Image processing technology was used for exploiting relevant softwaremodule, the characteristic parameters of the bonding interface, such as voids' distribution, size, andbond yield could be quickly obtained. Sequentially, the primary evaluation of the wafer bondingquality was realized. Combined this instrument with wafer-bonder, the real-time supervision of bond-ing process was achieved. Combining...

Based on the infrared transmission theory, an IR-detecting instrument for testing waferbonding quality were framed. Image processing technology was used for exploiting relevant softwaremodule, the characteristic parameters of the bonding interface, such as voids' distribution, size, andbond yield could be quickly obtained. Sequentially, the primary evaluation of the wafer bondingquality was realized. Combined this instrument with wafer-bonder, the real-time supervision of bond-ing process was achieved. Combining bonding strength, the parameter of bonding techniques wasoptimized by analyzing the wafer bonding quality, which include the bond yield and distribution ofvoids, in different bonding condition. It is helpful for comprehening the mechanism of wafer bonding.

基于晶片的红外透射原理,设计并搭建了晶片直接键合质量红外检测装置,并利用图像处理技术开发了相应的软件模块,可以快速获取键合界面的特性参数,如空洞分布、大小及键合率等,从而实现晶片直接键合质量的快速评估。同时,将该红外检测装置与硅片键合装置结合一体,可以实时监测硅片直接键合工艺。通过分析不同工艺条件下所获得的键合片质量,包括键合率、缺陷分布以及键合强度等参数的比较,可以有助于理解晶片键合的机理,实现键合工艺的优化。

 
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