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mechanical polishing     
相关语句
  机械抛光
     Study on the Chemical Mechanical Polishing of ZnSe Polycrystal
     ZnSe多晶化学机械抛光研究
短句来源
     Material Removal Mechanism and Model on Chemical Mechanical Polishing in ULSI
     ULSI化学机械抛光(CMP)材料去除机制模型
短句来源
     Chemical mechanical polishing (CMP) is an innovative technique to traditional surface manufacture process.
     化学机械抛光(Chemical mechanical polishing ,CMP)是对传统表面加工工艺的革命。
短句来源
     Currently, Chemical Mechanical Polishing (CMP) is the most effective technology to obtain the ultra smooth and damage free surface of wafer and the only way to achieve the local and global planarization of wafer.
     目前,化学机械抛光(Chemical Mechanical Polishing简称CMP)是硅片加工和多层布线层间平坦化中最终获得纳米级超光滑无损伤表面的最有效工艺方法,也是能够实现局部和全局平坦化的实用技术。
短句来源
     Material Removal Mechanism and Model in Chemical Mechanical Polishing of Silicon Wafers
     硅晶片化学机械抛光材料去除机制与模型
短句来源
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  机械磨光
     A set of conventional processing methods of vana dium and vanadium alloy specimens, including mechanical polishing, mechanical ch emical polishing, chemical etching as well as relevant techniques and experience s is introduced.
     介绍了一种钒及钒基合金金相试样的常规制样方法,即试样的机械磨光,机械化学抛光,化学侵蚀等技术和经验。
短句来源
     Based upon analysis of the reasons caused the cracks in concrete pre-control measures and optimal mix proportion design are introduced. High accuracy regulation and control technology and mechanical polishing technique are adopted, which ensure construction of large area concrete carborundum floor.
     通过对混凝土产生裂缝的原因进行分析,采取预控措施,优化配合比设计,采用了高精度螺纹调控技术控制成型地面的平整度和机械磨光施工技术,保证了大面积混凝土金刚砂地面的施工质量。
短句来源
  机械研磨
     Ultrasonic Mechanical Polishing of End Face of Fiber Optic Connector
     光纤连接器端面超声机械研磨(英文)
短句来源
     Based on the ultraprecision polishing methods that studied at home and abroad, this paper studies and develops a new ultraprecision polishing techniquewhich combines NC machining electrolytic machining and mechanical polishing.
     在综合研究国内外型腔表面超精密研磨技术的基础上,开发研制了将数控切削、电解加工及机械研磨等技术相复合的数控展成起精密电解研磨新工艺,实现了对模具型腔的高效镜面加工。
短句来源
     diffusion,Rapid Thermal Processing (RTP),ion implantation,Chemical Vapor Deposition (CVD),Physical Vapor Deposition(PVD)and Chemical Mechanical Polishing(CMP)respectively. Then make some suggestions for future development trends.
     扩散技术、快速高温处理(RTP)技术、离子注入技术、化学气相沉积(CVD)技术、物理气相沉积(PVD)技术以及化学机械研磨(CMP)技术等分别加以介绍,然后对未来的发展动向提出一些建议。
短句来源
     Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, microelectro-mechanical system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleclroless nickel, recycling of alkaline etching solution and reclaiming system of copper.
     介绍了电子电镀中的若干新工艺新技术,如芯片电镀、电化学机械研磨、微机电系统电镀、不溶性阳极电镀铜、镀铂铌电极以及无铅无镉中磷光亮化学镀镍、碱性蚀刻液再生和铜回收系统等。
短句来源
  机械减薄
     A BESOI film with 0. 4 μm top silicon was obtained by mechanical polishing and oxidation stripping.
     用机械减薄和氧化剥层法获得表层硅厚度约0.4μm的BESOI薄膜。
短句来源

 

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      mechanical polishing
    The frequency dependence of impedance Z is determined by the tellurium surface treatment (mechanical polishing, chemical etching).
          
    It is found that chemical mechanical polishing can reduce their surface roughness to a level comparable with that of the original Si(001) substrates.
          
    Defects were introduced into silicon plates by traditional mechanical polishing.
          
    It has been shown that the defects generated by mechanical polishing transform into dislocations and dislocation loops and that SiO2 precipitates also form as a result of annealing at temperatures of 850 to 1000°C.
          
    The surface of the Si1-xGex/Si(001) (x ~ 25%) buffer layers is subjected to chemical mechanical polishing.
          
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    Electropolishing is superior to mechanical polishing in efficiency and cost.It can be widely used for hard alloy,stainless steel,Cu and its alloys surface finishing,and especially for parts with complicated figuration.It's based on the theory of sticky fluid film and the action of anodic passivation.Bath composition:H_3PO_4 86%,CrO_3 12%,H_2O 2% D_A 150-2000 A/dm~2,Temperature 50±5℃,Time 4-9 min.Factors effecting the operation are also studied.

    电化学抛光比机械抛光琦生产效率高而且成本也较低,尤其适用于形状复杂的零件。它也不受材料品种的限制,可适用于硬质合金、不锈钢、铜及铜合金等等。它的基本原理是粘膜理论和阳极钝化作用。本文给出了铜及其合金的抛光液配方工艺:H_3PO_486%CrO_3 12%H_2O2%D_A150~2000A/dm~2温度50±5℃,时间4~9分,并对影响电抛光的工艺因素进行了探讨。

    Heat transfer characteristics of the new surfaces were determined through temperature measurement, and the results obtained were compared with dropwise condensation studies from various sources. The differences in heat transfer between Cu-Cr and mechanical polishing surfaces were discussed. Life-time experiments were conducted on both Cu-Cr surface and mechanical polishing surface. Perfact dropwise condensation gave a life-time of over 8500 hours.

    采用直接测温的方法,测定了新表面材料的滴状冷凝传热特性,并同国外滴状冷凝传热研究的结果进行比较.分析讨论了Cu-Cr表面和机械抛光表面传热性能的差异.对Cu-Cr和机械抛光两种表面进行了寿命实验,滴状冷凝现已超过8500小时.

    In this paper mechanical polishing; Chemical polishing and hydrogen reduction methods used im cleaning bearing steel surface for oxygen determination have been studied. The optimal conditions for the determination are chosen. In these conditions satisfactory results have been obtained.

    本文研究了用机械抛光、化学抛光和氢还原法处理轴承钢表面对测定氧的影响。试验了测定的最佳条件,用拟定的方法分析轴承钢中氧和氮获得了满意的结果。

     
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