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diffusion equation of liquid film
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  液膜扩散方程
     Kinetics of gold desorption with a new resin(P-950) in acidic thiourea solution was investigated. The experimental results demonstrated that the desorption of auric-thiourea com ̄plex fromthe resin can be describedbyBoyd’s diffusion equation of liquid film.
     用硫脲溶液从载金P-950哌啶树脂解吸金的动力学研究表明,该解吸金的动力学符合Boyd液膜扩散方程,解吸金的速率随盐酸浓度的增加而下降;
短句来源
     Kinetics of palladium desorption from a new type resin (P 950) in acidic thiourea solution was investigated. The experimental results demonstrated that the desorption of palladium thiourea complex from the resin can be described by Boyds diffusion equation of liquid film.
     用酸性硫脲溶液从载钯P-950哌啶树脂解吸钯的动力学研究结果表明,该解吸过程的动力学遵循Boyd液膜扩散方程,解吸钯的速率随盐酸浓度的增加而下降;
短句来源
     E. Boyd's diffusion,equation of liquid film, Langmuir isotherm and Freundlich isotherm, etc. The results were the same as that made by Origin 7.0, and the correlation coefficients were all close to 1.
     使用曲线拟合函数polyfit,采用G.E.Boyd液膜扩散方程、Langmuir吸附等温式和Freundlich吸附等温式等对实验数据进行了线性拟合,拟合结果和使用Origin7.0拟合结果相同,且线性相关系数均接近于1。
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  相似匹配句对
     Discussion on Relationship Between Boyd Equation and Diffusion Mechanism of Liquid Film
     Boyd方程与液膜扩散机理的关系
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     The results showed that the sorption was controlled by the liquid film diffusion;
     静态吸附结果表明 :吸附属于液膜扩散控制机理 ;
短句来源
     An Equation Correlating Liquid Diffusion Coefficient with Concentration
     一个液体扩散系数与浓度的关联方程式
短句来源
     The results show that the adsorption kinetic is controlled by liquid film diffusion.
     结果表明,动力学吸附过程为液膜扩散控制;
短句来源
     The exchange-adsorption rate is mainly controlled by liquid film diffusion;
     吸附交换速率主要受液膜扩散控制;
短句来源
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Kinetics of gold adsorption with new type C411 resin and elution was studied in this paper. The experimental results show that the adsorption and elution can be described by the Boyd diffusion equation of liquid film. The adsorption rate of gold decreases with the increase of HCl concentration. The distribution coeffcient of adsorption is K=4.75×10~(-4)s~(-1) and the apparent heat effect of adsorption is ΔH=12.43kJ/mol. The distribution ratio of gold adsorption increases with the increase of temparature,...

Kinetics of gold adsorption with new type C411 resin and elution was studied in this paper. The experimental results show that the adsorption and elution can be described by the Boyd diffusion equation of liquid film. The adsorption rate of gold decreases with the increase of HCl concentration. The distribution coeffcient of adsorption is K=4.75×10~(-4)s~(-1) and the apparent heat effect of adsorption is ΔH=12.43kJ/mol. The distribution ratio of gold adsorption increases with the increase of temparature, It is shown that the adsorption process of gold with C411 resin is a heat-absorbing reaction. The elution characteristic of gold with thiourea solution was also studied.

对大孔交联哌啶树脂吸附与解吸金的动力学研究结果表明,吸附和解吸均符合Boyd液膜扩散方程,吸附金的速率是随着HCl浓度的增加而下降。实验测得的吸附扩散系数K=4.75×10~(-4)s~(-1),吸附表观热效应△H=12.43kJ/mol。当温度升高时,吸附金的分配比上升,表明该树脂吸附金是吸热反应。还研究了硫脲解吸金的特性。

Kinetics of gold adsorption by a new type resin (P-950) was investigated. The experimental results demonstrated that the kinedcs of gold adsorption from chloride solution by this kind resinis accord with Boyd's diffusion equation of liquid film. The absorption rate of gold reduced remarkablywith the increase of HCI concentration. The distribution coefficient of adsorption K was 5. 58×10-5s-1 and the apparent heat effect of the adsorption △H was 25. 92 kJ/mol. That the distributionratio of gold adsorption...

Kinetics of gold adsorption by a new type resin (P-950) was investigated. The experimental results demonstrated that the kinedcs of gold adsorption from chloride solution by this kind resinis accord with Boyd's diffusion equation of liquid film. The absorption rate of gold reduced remarkablywith the increase of HCI concentration. The distribution coefficient of adsorption K was 5. 58×10-5s-1 and the apparent heat effect of the adsorption △H was 25. 92 kJ/mol. That the distributionratio of gold adsorption D enlarged with the increase of temperature indicated that the adsorption process of gold on the resin was an endothermal reaction.

研究P-950哌啶树脂吸附金的动力学结果表明:该树脂从氯化物溶液中吸附金的动力学符合Boyd液膜扩散方程,吸附金的速率随盐酸浓度的增加而下降.当温度上升时,吸附金的分配比增加,表明该树脂吸金是吸热反应.测得的液膜扩散系数K=5.58×10-5s-1,吸附表观热焓△H=25.92kJ/mol.

Kinetics of gold desorption with a new resin(P-950) in acidic thiourea solution was investigated.The experimental results demonstrated that the desorption of auric-thiourea com ̄plex fromthe resin can be describedbyBoyd’s diffusion equation of liquid film.The desorption rate of gold reducedremarkably with the increase of HCl concentration.The increace of thioureaconcentration and temperature accelerated the desorption of auric-thioureacom ̄plex.The distribution coefficient of the desorption K was4.24×10-4s-1...

Kinetics of gold desorption with a new resin(P-950) in acidic thiourea solution was investigated.The experimental results demonstrated that the desorption of auric-thiourea com ̄plex fromthe resin can be describedbyBoyd’s diffusion equation of liquid film.The desorption rate of gold reducedremarkably with the increase of HCl concentration.The increace of thioureaconcentration and temperature accelerated the desorption of auric-thioureacom ̄plex.The distribution coefficient of the desorption K was4.24×10-4s-1 and the apparent activation energy of the desorption E awas 41.79kJ/mol.

用硫脲溶液从载金P-950哌啶树脂解吸金的动力学研究表明,该解吸金的动力学符合Boyd液膜扩散方程,解吸金的速率随盐酸浓度的增加而下降;当温度上升时,解吸金的速率增加;提高硫脲浓度,有利于金的解吸。测得的液膜扩散系数K=4.24×10-4s-1,解吸表观活化能Ea=41.79kJ/mol。

 
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