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high performance copper clad laminate
相关语句
  高性能覆铜板
     THERMOSETTING RESIN FOR HIGH PERFORMANCE COPPER CLAD LAMINATE
     高性能覆铜板用热固性树脂
短句来源
     Application of polyarmid fiber to high performance copper clad laminate
     芳纶纤维在高性能覆铜板中的应用
短句来源
     Cross-linkable polyphenylene ether resin for high performance copper clad laminate
     高性能覆铜板用交联性聚苯醚树脂
短句来源
     Polyphenylene Ether/Epoxy Resin Used for High Performance Copper Clad Laminate
     高性能覆铜板用聚苯醚/环氧树脂体系
短句来源
     The requirement of matrix resin for the high frequency and high performance copper clad laminate was introduced and polyphenylene ether resin,cyanate resin and polyimide resin were also discussed in detail.
     介绍了高频高性能覆铜板对基材的性能要求,详细讨论了聚苯醚树脂、氰酸酯树脂及聚酰亚胺树脂的特性,并简要介绍了各种树脂基覆铜板的应用情况。
短句来源
  “high performance copper clad laminate”译为未确定词的双语例句
     ADVANCE IN THE RESEARCH OF HIGH PERFORMANCE COPPER CLAD LAMINATE BASED ON RESIN MATRIX
     高性能树脂基覆铜板的研究进展
短句来源
     Poly(phenylene oxide) with a low molecular weight suitable for matrix resin in high performance copper clad laminate was synthesized by oxidative coupling of 2,6-dimethylphenol.
     本文采用2,6-二甲基苯酚(DMP)溶液氧化偶合聚合的工艺方法,合成作为线路板基材的低分子量的聚苯醚(PPO)。
短句来源
     Copper clad laminate with not only excellent flame retardancy, but also excellent other properties which can gratify the need of high performance copper clad laminate has been prepared by using proper flame retardant resin systems.
     并用实验得到的合适的阻燃树脂体系制得了不但阻燃性能优异,而且其他性能指标均优异的覆铜板,完全能满足目前对高性能阻燃树脂基覆铜板的要求。
短句来源
     The development and recent situation of high performance copper clad laminate based on novel epoxy, bismaleimide, cyanate ester, etc. thermosetting resins and polyphenyl ether, polytetrafluoroethylene polyimide, etc.
     对高性能新型环氧树脂、双马来酰亚胺、氰酸酯等热固性树脂及聚苯醚、聚四氟乙烯、聚酰亚胺等热塑性树脂基覆铜板的近况及发展进行了综述。
短句来源
     Furthermore,the applications of these laminate were also briefly mentioned. Analysis showed that allylated polyphenylene ether resin was the ideal and the first choice material for high frequency and high performance copper clad laminate.
     通过分析认为:烯丙基化聚苯醚树脂(A PPE)是高频应用的理想材料,为高频高性能电路基板材料首选的树脂基体。
短句来源
  相似匹配句对
     It has high performance and specificity.
     RNAi具有高效特异性的特点。
短句来源
     High-Performance Concrete
     高性能混凝土
短句来源
     COPPER
     铜
短句来源
     ALUMINUM CLAD STEEL PLATE
     铝复合钢板
短句来源
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     层压合成地板的清洁保养
短句来源
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The requirement of the high performance copper clad laminate for matrix resin was introduced first,and then the parameters of effecton the properties of epoxy/poly(phenylene oxide)were discussed in detail.Furthermore the properties and the applications of the system as the matrix of copper clad laminate were also mentioned.

介绍了高性能覆铜板对基材的性能要求、聚苯醚 /环氧树脂体系性能的控制参数及其对体系性能的影响

Compared with glass fiber,polyarmid fiber may be the preferred choice as the insula-tion-enhanced material for the copper clad laminate.Polyarmid fiber possesses many good characteristics such as low specific gravity and coefficient of thermal expend,low dielectric constant and dielect ric dissipation factor,and suitable for Laser drilling of CO 2 .It will be widely applied to high frequency and reliability electronic products.Based on the requirement of the development of the high performance copper clad...

Compared with glass fiber,polyarmid fiber may be the preferred choice as the insula-tion-enhanced material for the copper clad laminate.Polyarmid fiber possesses many good characteristics such as low specific gravity and coefficient of thermal expend,low dielectric constant and dielect ric dissipation factor,and suitable for Laser drilling of CO 2 .It will be widely applied to high frequency and reliability electronic products.Based on the requirement of the development of the high performance copper clad laminate,the characteristics of the polyarmid fiber,it's application to copper clad laminate and the related research progress are introduced in this paper.

在19篇论文的基础上 ,综述了芳纶纤维作为覆铜板的增强绝缘材料的优良特点 :重量轻、热膨胀系数小、低介电常数、低介质损耗因数、易于CO2 激光蚀孔加工等 ,在高频、高可靠性电子产品中有广阔的应用前景。

The development and recent situation of high performance copper clad laminate based on novel epoxy, bismaleimide, cyanate ester, etc. thermosetting resins and polyphenyl ether, polytetrafluoroethylene polyimide, etc. thermoplastic resins are summarized. The application of novel epoxy system, curing system and its modified agent are mainly discussed. The key of development of copper clad laminates is to strength the research of novel resin which has high...

The development and recent situation of high performance copper clad laminate based on novel epoxy, bismaleimide, cyanate ester, etc. thermosetting resins and polyphenyl ether, polytetrafluoroethylene polyimide, etc. thermoplastic resins are summarized. The application of novel epoxy system, curing system and its modified agent are mainly discussed. The key of development of copper clad laminates is to strength the research of novel resin which has high performance such as high thermal resistance, excellent dielectric properties, flame retardance and environment protection, anti UV and AOI function.

对高性能新型环氧树脂、双马来酰亚胺、氰酸酯等热固性树脂及聚苯醚、聚四氟乙烯、聚酰亚胺等热塑性树脂基覆铜板的近况及发展进行了综述。对用于覆铜板的新型环氧树脂体系、环氧固化体系、环氧改性剂的应用进行了重点阐述 ,并指出发展覆铜板的关键是加强高性能树脂基体的研究 ,即研制具有高耐热性、优异介电性能、阻燃环保性、能阻挡紫外光和具有自动光学检测功能等特性的树脂是今后的发展方向。

 
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