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general illumination
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  “general illumination”译为未确定词的双语例句
     The roadmap of semiconductor-based SSL-LED for general illumination in the U.S. by 2020
     美国半导体SSL-LED的发展规划
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     Due to the outstanding benefits of LED compared with the traditional light sources, as well as the huge promising exist and potential for gaining markets share in the general illumination and vehicle forward lighting, and etc. , international governments and global industries put huge investments into the R&D of white LED illumination source, inevitably, which will result in the further progress of optoelectronics, material, energy, semiconductor chip fabrication and packaging technology fields and etc.
     由于白光HB-LED 与传统光源相比的突出性能以及其未来的巨大市场前景,各个国家地区争相投资研发白光LED照明光源,这也将推动相关的光电子、材料、能源、半导体芯片制作以及封装行业等进一步的发展。
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  相似匹配句对
     In general,L.
     L.
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     general;
     (2)总论;
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     Illumination of Truth
     真理的启示——读加达默尔的《真理与方法》
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     Illumination on Definition of GB4706 Standards of Part of General Requirements
     GB4706系列标准释义通用要求部分——定义(三)
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     Illumination on Definition of GB4706 Standards of Part of General Requirements
     GB4706系列标准释义通用要求部分——定义
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  general illumination
Both species responded to general illumination by first moving the tail or head and then by swimming.
      
The problem is solved for a general illumination (electric and magnetic line sources).
      
We also plan to generalize to more general illumination situations with more than one light sources.
      
We especially focus on the constraints imposed on those design choices if SSL-LED technology is to fulfill its promise for general illumination.
      
The patient compartment shall be equipped with general illumination as well as focus type lighting for each litter position.
      
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An overview of light emitting diode(LED) technology is given,including a preview of the future potential of LEDs in comparison with other types of light sources. Recent achievements have resulted in substantial LED utilization in colored light applications. High power white light LEDs are beginning to be utilized in portable and specialty applications. General illumination using LEDs can be expected in the future assuming continuing breakthroughs in performance and cost.

文章介绍了发光二极管材料和器件的研究、开发的历史 ,概述了发光二极管技术的发展现状和进展 .通过与其他类型光源的比较 ,向读者展示了发光二极管未来的重要地位和光明前景 .发光二极管的最近的成就是实现了有色光方面的成功应用 .高功率白色发光二极管已开始应用于便携式和特殊照明 .而在通用的照明领域要成功地应用发光二极管 ,则需要通过性能和价格方面的继续突破来实现

Based on analyzing the general illumination models and the features of the realistic image rendering on fabric, it is built in this paper the special illumination model with low complexity and high realistic effect. Then it is stated the principles and approaches on the realistic image rendering under changing of illumination, and the results of weft knitted jacquard fabrics are also presented.

本文从常用的光照模型着手,分析了织物的真实感图形绘制特点,建立了一种复杂程度较低而逼真效果较好的特殊光照模型,在此基础上,阐述了基于变化光照条件的织物真实感图形绘制的基本原理及具体实现方法,并给出纬编提花织物基于不同光照条件下的真实感图形实例。

Light-emitting diodes (LEDs) are a strong candidate for the next-generation general illumination applications. LEDs are making great strides in brightness performance and reliability; however, the barrier to widespread use in general illumination still remains the cost (dollars per lumen). For increasing the luminous flux of LED, the input power for chip of LED needs to be greater than before, and the thermal density inside LED will increase violently. However, the luminous efficiency and the life...

Light-emitting diodes (LEDs) are a strong candidate for the next-generation general illumination applications. LEDs are making great strides in brightness performance and reliability; however, the barrier to widespread use in general illumination still remains the cost (dollars per lumen). For increasing the luminous flux of LED, the input power for chip of LED needs to be greater than before, and the thermal density inside LED will increase violently. However, the luminous efficiency and the life of chip will decrease at the high temperature condition, even the chip may be out of order or damaged. A good packaging technology is the way to solve the heat dissipation problem, but it is a challenge to develop this technology in the limited space of LED. The purpose of heat dissipating technology for LED is to decrease the working temperature of LED's chip. It is necessary to reduce the thermal resistance of LED package. The efficiency and reliability of solid-state lighting devices depends strongly on successful thermal management, because the junction temperature of the chip is the prime driver for effective operation. As the power density continues to increase, the integrity of the package electrical and thermal interconnects becomes extremely important.In this work, packaging experiments of high-power LEDs were studied using localized induction heating technique. The results show that, owing to the selectivity of induction heating with materials and geometry, only the electroless plated Cu-Sn alloy solder layer in chip area is heating and solder bonding between chip and copper-coated ceramic substrate is promised. Because of high thermal conductivity of Cu-Sn alloy, this novel packaging technique not only decrease the thermal resistance, making the p-n junction of LED kept at a low temperature even with a high current (four-fold of rated current), but also decrease thermal stress and avoid the damage of the chip, all of which will improve the performance and reliability of LED.

采用感应局部加热技术,对大功率发光二极管(LED)封装进行了试验研究。结果表明,由于感应加热对材料和结构具有选择性,封装过程中仅Cu-Sn合金焊料层加热,实现了芯片和覆铜陶瓷基板间的热键合。封装后的LED性能测试表明,该封装技术不仅降低了热阻,使LED在高电流下(4倍电流)仍能保持较低的工作温度,而且降低了热应力和整体高温对芯片结构的损坏,提高了器件性能和可靠性。

 
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