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copper citrate
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  柠檬酸铜
    A kind of non-cyanide alkaline copper plating bath was prepared with copper citrate as main salt and by adding potassium hydrate and suitable brightener into the bath.
    采用柠檬酸铜为主盐,加入氢氧化钾和合适的光亮剂,配制出一种无氰碱性镀铜液。
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  copper citrate
Copper electrodeposition in polyaniline-coated electrodes is studied using copper citrate complex anions as reducing species.
      
Influence of copper anion complexes on the incorporation of metal particles in polyaniline Part I: Copper citrate complex
      
Results concerning number, size and shape of copper crystals deposited in a similar way using three different reducing species (i.e., copper cations, copper citrate and copper oxalate complex anions) are compared.
      
The injection of copper citrate into pregnant golden hamsters induces a specific pattern of cardiovascular malformations in their embroys.
      


A kind of non-cyanide alkaline copper plating bath was prepared with copper citrate as main salt and by adding potassium hydrate and suitable brightener into the bath. The optimal current density obtained by Hull Cell test was 0.5~2 A/dm~2. The adhesion of the copper deposits was tested when copper, copper alloys and zinc alloys were used as substrates respectively and the copper deposits were used as the bottom layers of Cr deposits. The deposition rate, current efficiency, polarization...

A kind of non-cyanide alkaline copper plating bath was prepared with copper citrate as main salt and by adding potassium hydrate and suitable brightener into the bath. The optimal current density obtained by Hull Cell test was 0.5~2 A/dm~2. The adhesion of the copper deposits was tested when copper, copper alloys and zinc alloys were used as substrates respectively and the copper deposits were used as the bottom layers of Cr deposits. The deposition rate, current efficiency, polarization curves and bath stability of the non-cyanide alkaline copper plating were studied. The results show that both the adhesion of the deposits and the bath stability are satisfactory, and the deposition rate and current efficiency are high. Moreover, the polarizability of the non-cyanide alkaline copper plating is superior to that of pyrophosphate salt copper plating.

 采用柠檬酸铜为主盐,加入氢氧化钾和合适的光亮剂,配制出一种无氰碱性镀铜液。通过赫尔槽试验确定其合适的电流密度范围为0 5~2A/dm2。分别对该无氰碱性镀铜层在铜基体、铝合金基体、锌合金基体上以及以该镀层作为镀铬层的底层时的结合力进行了测定,表明该镀铜层的结合力较好。测定该镀铜的沉积速率、电流效率、极化曲线以及镀液稳定性的结果表明,该无氰镀铜的电流效率与沉积速率都较高,极化度优于焦磷酸盐镀铜,且该镀液的稳定性较好。

>=Cyanide copper plating cannot be substituted for many years, but it must be retreated from plating industry for its severe toxicity. A new process for non-cyanide alkaline copper plating are presented. Copper citrate is used for main salt and potassium hydroxide is used for adjusting the PH. The very bright copper coating that has fine crystal and high binding strength is deposited on the steels, aluminum alloys, zinc die alloy castings, copper alloys, stainless steels, tins....

>=Cyanide copper plating cannot be substituted for many years, but it must be retreated from plating industry for its severe toxicity. A new process for non-cyanide alkaline copper plating are presented. Copper citrate is used for main salt and potassium hydroxide is used for adjusting the PH. The very bright copper coating that has fine crystal and high binding strength is deposited on the steels, aluminum alloys, zinc die alloy castings, copper alloys, stainless steels, tins. The tests show that it is possible to substitute the process for cyanide copper completely.

多年来氰化镀铜一直是不可完全替代的镀铜工艺,但剧毒的特性使得它必须退出电镀行业。本文所述工艺以柠檬酸铜为主盐,以氢氧化钾来调整PH值,在钢铁件、铝合金件、锌合金压铸件、铜合金件、不绣钢件、锡件上得到了结晶细致、光亮度高、结合力好的铜镀层,有望完全替代氰化镀铜。

 
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