heat dissipation performance 散热性能(5)   散热性能      The analysis results show: heat sinks of integrate heat pipe have good heat dissipation performance, they can control surface temperature of a CPU with power 140 W to below 45℃ when the air flow rate of fan is 0.011 5 m3/s, and they can meet high heat flux density cooling requirement of electronic apparatus.      分析结果表明:集成热管散热器具有良好的散热性能,在风扇风量为0.0115m3/s时,就完全可以把功率在140W以上的CPU表面温度降至45℃以下,可满足高热流密度电子器件的冷却要求。 短句来源      Analysis of heat dissipation performance of three dimensionalmultichip module using CVD-diamond      CVD金刚石改善3D-MCM散热性能分析 短句来源      Analysis of Techniques in CPU Heat Dissipation and Heat Dissipation Performance      常用CPU散热方式及散热性能分析 短句来源      The result indicated that its heat dissipation performance satisfied totally the 115 W CPU's heat dispel request,and indicated that only improving the motor fan's rotate speed can't increase the exchanger and the system performance efficiently.      结果表明,其散热性能完全满足115 W发热量CPU的散热要求。 指出单纯提高风扇的转速不能有效提高散热器及系统的整体性能。 短句来源      Taguchi robust design method was applied to the design of silicon microchannel heat sinks. Reduced model for heat transfer analysis of microchannel heat sinks was built and the key parameters for their heat dissipation performance were identified. Orthogonal experiments were designed and signal-noise ratios were calculated to carry out the robust optimization of the key parameters.      将田口稳健设计方法用于硅基微通道热沉的优化设计,建立了微通道热沉的简化性能分析模型,确定了影响其散热性能的关键参数,利用正交试验和信噪比分析实现了参数的稳健优化。 短句来源   “heat dissipation performance”译为未确定词的双语例句      Finite element analysis of the heat dissipation performance of CPU radiator      CPU散热器热学性能的有限元分析 短句来源   相似匹配句对      Boiler Heat Dissipation Flux Measurement      锅炉散热量的实时测量 短句来源      4)Heat dissipation and system control.      4 )散热与控制并与其他储能化学电源的性能特点作了比较 . 短句来源      SYMMETRY AND HEAT      对称性和热学 短句来源      Analysis of Techniques in CPU Heat Dissipation and Heat Dissipation Performance      常用CPU散热方式及散热性能分析 短句来源      Finite element analysis of the heat dissipation performance of CPU radiator      CPU散热器热学性能的有限元分析 短句来源 查询“heat dissipation performance”译词为用户自定义的双语例句     我想查看译文中含有：的双语例句 为了更好的帮助您理解掌握查询词或其译词在地道英语中的实际用法，我们为您准备了出自英文原文的大量英语例句，供您参考。   heat dissipation performance Experiments have been conducted to investigate the effects of miniaturizing the base plate dimensions of horizontally-based straight rectangular fin arrays on the steady state heat dissipation performance. 例句来源       The heat dissipation performance of the measuring heads is matched to the required cooling temperature. 例句来源                The temperature and flow fields of CPU heat sink Cooled by vertical jet are investigated based on numerical method. Furthermore, the recirculating flow is found under the low part of the fin, and it would deteriorate the heat dissipation at a certain degree. The heat dissipation performance of CPU heat sink cooled by vertical uniform jet is analyzed by numerical simulation under different conditions. These results are useful for the design of the heat sink wit...             对垂直射流下CPU散热器的流场及温度场进行了数值模拟,得到了CPU散热器流场及温度场的分布规律,指出近底面肋片间存在回流区,明显影响传热。分析了CPU散热器在射流时不同情况下的散热性能,计算所得数据有助于CPU散热器的设计与改进。 文摘来源          AlGaN/GaN HEMT grown on sapphire substrates using FC bonding for heat dissipation is demonstrated and the mechanism of FC bonding is discussed.A model based on thermal impedance is used to analyze the heat which is dissipated by FC bonding.The tested result shows,after FC,a much reduced thermal impedance of 14.9W/(cm·K),and a increased saturation current from 300mA/mm to 396mA/mm are obtained.Source-drain current drop in high DC power is not obviously observed in FC FET.So the AlGaN/GaN ...             采用FC技术将管芯倒扣至AlN基板散热的AlGaN/GaN HEMTs,并通过热阻模型分析了FC方式的散热机理.从测试结果看,器件的热阻可大幅降到14 .9K·mm/W,直流特性明显增加,饱和电流提高33%.表明采用FC技术有效改善了器件散热,而且引入的寄生电感较小,可获得更大输出功率.如果进一步完善频率特性的优化,可以加快FC技术的AlGaN/GaN大功率HEMT器件的实用化进程. 文摘来源          Based on the CFD analysis methods heat dissipation issue of electronic apparatus, simulate, and presented corresponding results. One heat sink for chip heat dissipation-heat sink of integrate heat pipe was given, and the pressure drop and the heat dissipating capacity of heat sink were investigated by altering wind velocity, working temperature of medium and pitch of fin, etc. Furthermore, simulation results are compared with experimental values and good...             用CFD软件分析电子元件散热问题的求解模型,并给出了相应模型的求解结果。介绍了一种芯片散热型热管——集成热管散热器。通过改变风速、工质工作温度、翅片节距等因素来测试散热器压阻和总散热量的变化,并与相关实验结果进行了比较。仿真结果与实验结果相当吻合。分析结果表明:集成热管散热器具有良好的散热性能,在风扇风量为0.0115m3/s时,就完全可以把功率在140W以上的CPU表面温度降至45℃以下,可满足高热流密度电子器件的冷却要求。 文摘来源   << 更多相关文摘         相关查询: heat dissipation dissipation heat body heat dissipation heat dissipation model heat dissipation loss heat dissipation conditions heat dissipation process heat dissipation rate surface heat dissipation poor heat dissipation heat dissipation mode heat dissipation characteristic  对查询结果不满意

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