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copper physical development
相关语句
  铜物理显影
     A Study of the Mechanism of Copper Physical Development
     铜物理显影机理的研究
短句来源
     The polarization curves of copper physical development (CuPD) system were obtained by transient constant current step method on copper plated platinum electrode.
     本文采用镀铜铂电极和暂态恒电流阶跃的方法测得了铜物显(铜物理显影)体系的极化曲线。
短句来源
     AN IMAGING PROCESS WITH MULTI-STAGE AMPLIFI-CATION BY COPPER PHYSICAL DEVELOPMENT Ⅱ. PRODUCTION OF ELECTRICALLY CONDUCTIVE IMAGE
     用铜物理显影的多级放大成像过程——Ⅱ.获得能导电的影像
短句来源
     KINETICS AND MECHANISM OF COPPER PHYSICAL DEVELOPMENT——AN ELECTROCHEMICAL APPROACH
     铜物理显影动力学和机理——电化学探讨
短句来源
     Remedying Weak Silver Images by Copper Physical Development
     铜物理显影挽救微弱银影像
短句来源
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  “copper physical development”译为未确定词的双语例句
     The first step, which is fast at the room temperature,is the formation of Au ̄+,andthe second step,which is relatively slow,is the formation of gold. Au ̄+ and gold mightact as catalytic nuclei during the copper physical development depositing copper in thenon-image area.
     第二步由Au ̄+还原成金,这个反应比较慢,Au ̄+和Au在物理显影中可作为催化核,使铜在非影像区沉积。
短句来源
  相似匹配句对
     A Study of the Mechanism of Copper Physical Development
     铜物理显影机理的研究
短句来源
     Development of the Copper Manikin
     暖体假人的研制
短句来源
     Symmetry and physical development
     对称性和物理学的发展
短句来源
     Remedying Weak Silver Images by Copper Physical Development
     铜物理显影挽救微弱银影像
短句来源
     KINETICS AND MECHANISM OF COPPER PHYSICAL DEVELOPMENT——AN ELECTROCHEMICAL APPROACH
     铜物理显影动力学和机理——电化学探讨
短句来源
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The polarization curves of copper physical development (CuPD) system were obtained by transient constant current step method on copper plated platinum electrode. The results showed that the cathode polarization curve for the reduction of Cu2+ and the anode polarization curve for the oxidation of BH4 have a crossing point, which corresponds to a mixed potential (Emp) of -715 mV and a current density (iR) of 8.9×10-4 Acm-2. These values are approximately the same as determined directly on the CuPD...

The polarization curves of copper physical development (CuPD) system were obtained by transient constant current step method on copper plated platinum electrode. The results showed that the cathode polarization curve for the reduction of Cu2+ and the anode polarization curve for the oxidation of BH4 have a crossing point, which corresponds to a mixed potential (Emp) of -715 mV and a current density (iR) of 8.9×10-4 Acm-2. These values are approximately the same as determined directly on the CuPD system, i.e. Emp=-720 mV and in = 8.7×10-4 Acm-2, respectively. This implies that the mixed potential approach is reasonable. In the CuPD system, there is little influence between the cathode reduction of Cu2+ and the anode oxidation of BH4-. When the electrode was coated with gelatin, the reaction rate was lowered, r= 6.09 μgmin-1cm-2. This value is more approximate to the rate determined on the photographic layer, i.e. 4.82 μg min-1cm-2. The rate determined on clean electrode is much higher, 17.12 μg min-1cm-2. This showed the profound influence of gelatin on the physical development. The transfer coefficient a was obtained from the Tafel equation, and has a value of 0.48. This implies that the deposition of copper proceeds via two single electron transfer reactions, provided that the transfer of the first electron is rate-limiting.

本文采用镀铜铂电极和暂态恒电流阶跃的方法测得了铜物显(铜物理显影)体系的极化曲线。结果表明,单电极Cu~(2+)还原的阴极极化曲线与NaBH_4氧化的阳极极化曲线交点的混合电位E_(mp)=—715mV,对应的i_R为8.9×10~(-4)Acm~(-2)。这与直接测得的铜物显体系的E_(mp)=—720mV,和i_R=8.7×10~(-4)Acm~(-2)很相近。这意味着应用混合电位理论来分析铜物显过程是合理的。在铜物显的混合电极系统中,Cu~(2+)还原的阴极反应与BH_4~-氧化的阳极反应相互影响很小。当镀铜电极表面涂有明胶时,反应速率降低(6.09μgcm~(-2)min~(-1)),与动力学测得的结果(4.82μg cm~(-2) min~(-1))比较接近,而在不涂明胶的电极上反应速率则大得多(17.12 μg cm~(-2) min~(-1)),这表明了明胶对物显过程的显著影响。根据Tafel方程,从极化曲线斜率可求碍转移系数α=0.48,并推测铜沉积过程是两步单电子转移反应,且第一个电子的转移是控制步骤。

The shapes of silver image and copper image formed by copper physical development were studied by electron micrography, and the composition and the chemical state of the final image were studied by X-ray photoelectron spectrometry in this paper. It was indicated that silver filaments of the original image were transformed to branched silver halide by the activation process and new silver deposited in branched form first during the copper physical development, the newly formed silver contains two...

The shapes of silver image and copper image formed by copper physical development were studied by electron micrography, and the composition and the chemical state of the final image were studied by X-ray photoelectron spectrometry in this paper. It was indicated that silver filaments of the original image were transformed to branched silver halide by the activation process and new silver deposited in branched form first during the copper physical development, the newly formed silver contains two chemical states: monoatomic and polyatomic state. The silver at the image surface is exclusively in the monoatomic state. The presence of polyatomic state causes the shift of the binding energy of Ag3d to a low value. The stress in the crystal lattice caused by the deposition of copper forces silver atoms to diffuse to the image surface. Both newly formed silver and copper are catalytic. However, with increase of the time of copper physical development the amount of copper on the surface increases and silver is at last completely covered by copper. From then on the copper physical development continues because of the autocatalysis of copper.

本丈用透射电子显微镜研究了钢物理显影过程中银、铜颗粒的形貌;用X射线光电子能谱研究了银-铜影像的表面和体相的组成及化学状态。结果表明:在铜物理显影时,活化过程中银丝影像转变成树枝状,在以后的还原过程中银首先按枝状沉积,沉积的银包含两种化学状态单原子银和银原子簇,而影像表面为单原子银状态,银原子簇的存在使得Ag3d XPS有低能化学位移,铜的沉积未能完全遮盖住银表面,更由于铜的沉积产生的晶格张力促使银由体相向表面扩散,新生态的银和铜均具有催化活性,随着铜物理显影时间的增加,表面上的铜逐渐增加,最终银被铜完全遮盖,在这之后的铜物理显影是铜的自催化反应。

The distribution of copper and silver within the final image obtained by copper phys-ical development and the reduction of Au ̄(3+) by gelatin in non-image area were studied.Itwas indicated that the copper content increases with the increase of depth,whereas the sil-ver content decreases with the increase of depth,The shift of the bind energy of Ag3d to alow value shows that the silver in the interior of the image is in a mixed state of monoatomsand polyatoms,but the silver at the image surface is exclusively...

The distribution of copper and silver within the final image obtained by copper phys-ical development and the reduction of Au ̄(3+) by gelatin in non-image area were studied.Itwas indicated that the copper content increases with the increase of depth,whereas the sil-ver content decreases with the increase of depth,The shift of the bind energy of Ag3d to alow value shows that the silver in the interior of the image is in a mixed state of monoatomsand polyatoms,but the silver at the image surface is exclusively in a monoatomic state.Ifthe time of copper physical development is long enough,copper will completely cover silver.From then on the copper physical development continues because of the autocatalysis ofnewly formed copper.It was shown that much more chloroauric acid was absorbed in thenon-image area and hence the deposition speed of copper was much faster than that in theimage area.Gelatin can reduce Au ̄(3+). The reduction process might be divided into twosteps.The first step, which is fast at the room temperature,is the formation of Au ̄+,andthe second step,which is relatively slow,is the formation of gold.Au ̄+ and gold mightact as catalytic nuclei during the copper physical development depositing copper in thenon-image area.

本文研究了铜物理显影后影像中铜和银的分布以及在非影像区明胶对Au ̄(3+)的还原作用。铜含量随着影像深度的增加而增加,银含量却随着深度的增加而减少。Ag3d结合能向低值位移说明影像内部的银处于单原子和多原子的混合状态,但是影像表面的银却为单原子状态,如果铜物理显影进行得足够长,铜最终会将银全部遮盖。在这以后的铜物理显影是铜的自催化过程,样片浸入氯金酸溶液中后,非影像区中吸收的氯金酸量大大高于影像区,因而铜的沉积速度在非影像区也比影像区大得多.明胶能还原Au ̄(3+)。还原过程可分为两步:第一步由Au ̄(3+)还原成Au ̄+,这一步在室温下是快反应;第二步由Au ̄+还原成金,这个反应比较慢,Au ̄+和Au在物理显影中可作为催化核,使铜在非影像区沉积。

 
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