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cu matrix material
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  “cu matrix material”译为未确定词的双语例句
     The addition of Cu -Ce alloy is of benefit to the properties of Co-(6-6-3) Cu matrix material.
     铜铈(Cu-Ce)合金的添加有益于高钴的Co-663Cu青铜系的性能。
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  相似匹配句对
     MATERIAL
     原料
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     Material
     一、实验材料
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     FABRICATION OF Mo-Cu MATERIAL
     Mo-Cu材料的制作
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     Cu
     Cu;
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     Cu?
     用原子吸收分光光度计测定各组小鼠血清的 Zn、Cu、Fe。
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The properties of Co-base matrix materials were investigated. The Co content in the matrix has an important influence on the properties of matrix materials. Bonding strength of matrix to diamond particles impregnated, wear ratio (wear of the granite being cut to wear of the sawblade) and the height of diamond particle edging out of the matrix increase with the increase of the Co content. The addition of Cu -Ce alloy is of benefit to the properties of Co-(6-6-3)...

The properties of Co-base matrix materials were investigated. The Co content in the matrix has an important influence on the properties of matrix materials. Bonding strength of matrix to diamond particles impregnated, wear ratio (wear of the granite being cut to wear of the sawblade) and the height of diamond particle edging out of the matrix increase with the increase of the Co content. The addition of Cu -Ce alloy is of benefit to the properties of Co-(6-6-3) Cu matrix material.

研究了钴基胎体材料的性能。钴含量对胎体材料的性能有很大影响。胎体包镶金刚石的强度、磨损比(花岗石与刀块的磨损比)及金钢石的出刃高度均随钴含量的增加而提高。铜铈(Cu-Ce)合金的添加有益于高钴的Co-663Cu青铜系的性能。

1.0wt% Cd can effectively hinder the growth of oxide scale of Cu matrix material.0.1wt%La have the same effect on the resistence of the material to oxidation. The addition of Caccelerate the growth of scale. The scale growth law of the kind rnaterial of Cu-C-Cd does notor with the parabolic law, but the cubic law. In actual condition the growth law is verycomplex.

w(Cd)1.0%对铜基材料氧化膜的生长具有明显的抑制作用.w(La)0.1%对铜基材料的抗氧化性能的提高也起到积极的促进作用.金刚石的加入急剧加速了铜基材料氧化膜的生长速度.Cu-C-Cd系材料的氧化膜生长规律不遵循抛物线定律,而呈立方规律生长.实际条件下氧化膜的生长规律是复杂的.

Submicron SiC_p/Cu matrix materials were fabricated by powder metallurgy, using micron Cu and submicron SiCp (130nm) as the raw materials. The resulting materials were hot extruded to get rid of the possible void and increase compactness.The influence of submicron SiC_p content on electrical conductivity, Vickers hardness, ultimate tensile strength, elongation to failure and sliding wear-resistance, of submicron SiC_p/Cu matrix composites, were investigated.The results show...

Submicron SiC_p/Cu matrix materials were fabricated by powder metallurgy, using micron Cu and submicron SiCp (130nm) as the raw materials. The resulting materials were hot extruded to get rid of the possible void and increase compactness.The influence of submicron SiC_p content on electrical conductivity, Vickers hardness, ultimate tensile strength, elongation to failure and sliding wear-resistance, of submicron SiC_p/Cu matrix composites, were investigated.The results show that when the volume fraction of SiC_p increases from 0.5vol.% to 5.0vol.%, the electrical conductivity decreases from 96.2%IACS to 87.4%IACS, the Vickers hardness increases from 64.8MPa to (87.8)MPa, the ultimate tensile strength increases from 213.3 MPa to 217.3MPa and the elongation to failure decreases from 41.5% to 8.6%.The submicron SiC_p/Cu matrix composites exhibit excellent tribological properties. The wear mass loss of the 0.5vol. % SiC_p/Cu matrix composites and the 5.0vol. % SiC_p/Cu matrix composites are only 1/4.07~1/1.13 and 1/14.25~1/2.1 of that of commercially available T3 pure copper under the load of 300~1200N, respectively. The fatigue wear resulting from subsurface fatigue cracking is the main worn mechanism of the submicron SiC_p/Cu matrix composites. No obvious counterpart steel wear debris transfer is observed in the worn surface and subsurface of the submicron SiC_p/Cu matrix composites.

以亚微米级(130nm)碳化硅颗粒(SiCp)和微米级(10μm)Cu粉为原料,采用冷压烧结和热挤压方法制备出SiCp/Cu基复合材料,研究其SiCp含量对SiCp/Cu基复合材料电学、力学和摩擦学性能的影响。结果表明:当SiCp体积含量从0.5%增高到5.0%时,电导率从96.2%IACS下降到87.4%IACS,维氏硬度从64.8MPa增高到87.8MPa,抗拉强度从213.3MPa增大到217.3MPa,伸长率从41.5%下降到8.6%;SiCp/Cu基复合材料具有优良的摩擦学性能,0.5%SiCp/Cu基复合材料和5.0%SiCp/Cu基复合材料的磨损质量损失在载荷为300~1200N时分别仅是工业供应态T3铜的1/4.07~1/1.13和1/14.25~1/2.10,亚表层疲劳裂纹引发的疲劳磨损是SiCp/Cu基复合材料的磨损机理之一,磨损表面和亚表面没有明显的来自对磨钢的Fe元素。

 
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