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low melting glass
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  “low melting glass”译为未确定词的双语例句
     Application and Development of the Low Melting Glass with Composition Free of Pollution
     组成无公害低熔玻璃的发展现状
短句来源
     CaO,MgO and Fe_2O_3 impurities in kaolin can produce low melting glass at the grain-boundary of β'—Sialon sintered material and promote β'—Sialon powder's sintering.
     原料中 CaO,MgO 和 Fe_2O_3等杂质在高温烧结过程于晶界处形成低熔液相,加速了β'—Sialon 坯体烧结致密化进程。
短句来源
     The composition of these materials and low melting glass, as well as the microwave dielectric properties are presented.
     文中还列出了陶瓷组成、低熔点氧化物或玻璃的组成及相关材料的微波介电性能。
短句来源
     In this paper,glasses with com- position free of Pb、Hg、Cd、As、TI、Cr and radioactive elements are named as glasses free of pollution. Also,application and development of the low melting glass are reviewed.
     提出组成中不含 Pb、Hg、Cd、As、Tl、Cr 和放射性元素的玻璃称为组成无公害玻璃,综述了低熔玻璃的发展现状,指出电子产品目前所用含铅玻璃的取代物可能是磷酸盐、矾酸盐、铋酸盐玻璃。
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  相似匹配句对
     Low and N.
     Low和N .
短句来源
     Preparation of low-melting point PET
     低熔点PET的制备
短句来源
     Investigation of Low Melting Point Copolyester
     低熔点共聚酯的研制
短句来源
     Application of phosphate in low -melting sealing glass
     磷酸盐在低熔封接玻璃中的应用
短句来源
     Composition and Developments in Low-melting Seal Glasses
     低熔封接玻璃组成及其发展
短句来源
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  low melting glass
These electrodes are covered by a dielectric layer, which is made of low melting glass material.
      
The X and Y electrodes located on the front glass substrate are covered with low melting glass dielectric material.
      
Glass frits consist of a low-melting glass powder in a resin binder, which may be applied by silk-screen.
      


Atunable set internal cavity He-Ne paser tube is sealed by low melt glass.Its cavity length is 250MM.The characteristics of the He-Ne laser are long lifetime for continuous operation,and being able tooobtain optimum output power.Its output power is 3.2mW and the lifetime 20000 hours.

用低熔玻璃封接可调内腔式He-Ne激光管。它的特性是连续工作寿命长,可获得最佳输出功率,腔长是250mm。输出功率3.2mW寿命20000小时。

Low temperature sintering of PZT piezoelectric ceramics was studied. It was found that the sintering temperature of PZT ceramics could be reduced from about 1 250℃ to about 960℃ by the addition of small amount of low-melting glass powder (B2O3-.Bi2O3-CdO). The parameters of piezoelectrics are Kp = 0. 52~0. 58, Qm.≥1 000, ε33T/ε0 = 800~1 200, tgδ≤5 × 10-3. The microstructure, sintering mechanism and the effects of additive were discussed by means of scanning electronic microscope (SEM),...

Low temperature sintering of PZT piezoelectric ceramics was studied. It was found that the sintering temperature of PZT ceramics could be reduced from about 1 250℃ to about 960℃ by the addition of small amount of low-melting glass powder (B2O3-.Bi2O3-CdO). The parameters of piezoelectrics are Kp = 0. 52~0. 58, Qm.≥1 000, ε33T/ε0 = 800~1 200, tgδ≤5 × 10-3. The microstructure, sintering mechanism and the effects of additive were discussed by means of scanning electronic microscope (SEM), electron probe microanalysis (EPMA ), X-ray photo-electron spectroscopy (XPS ) and the measurement of volume shrinkage rate. A monolithic piezoelectric transformer was made of this material. Its alternate current no-load voltage stepup ratio is over 9 000.

对PZT压电陶瓷的低温烧结进行了研究。实验发现,在PZT陶瓷中添加少量低 熔玻璃(xB2O3-чBi2O3-zCdO)可使烧结温度从1250℃降低至960℃。其性能参数: Kp≥0.52~0.56,Qm≥1000,ε33T/ε0=800~1200, tgδ≤5×10-3.借助于扫描电镜 (SEM)、电子探针微区分析(EPMA)、X光光电子能谱分析(XPS)和体积烧缩速率的 测量,对陶瓷显微结构、烧结机理和添加剂的作用进行了讨论,所研制的低温烧结瓷料 巳用于制备独石压电陶瓷变压器,其空载交流升压比可高达 9 000以上。

In this paper, the manufacture of solder glass composed of PbO-ZnO-B_2O_3low-melting glass and synthesized β-eucryptite filler and the effect of the filler on the thermal expansion coefficient (α_c) of the solder, its softening temperature (T_f), sealing temperature (T_g), wet(?)ing and reologic properties arc studied; the action of the composite interface between the glass matrix and the filler is (?)scussed; and the process parameters as well as the suitable amount of filler to...

In this paper, the manufacture of solder glass composed of PbO-ZnO-B_2O_3low-melting glass and synthesized β-eucryptite filler and the effect of the filler on the thermal expansion coefficient (α_c) of the solder, its softening temperature (T_f), sealing temperature (T_g), wet(?)ing and reologic properties arc studied; the action of the composite interface between the glass matrix and the filler is (?)scussed; and the process parameters as well as the suitable amount of filler to be added for making a composite solder with thermal expansion coefficient(x_(25)-(?)) ranging from 45—75 ×10~(-7) / ℃ and T_f ranging from 400℃— 360℃ and with a low softening temperature and good wetting property are recommended.

本文研究了PbO—ZnO—B_2O_3系低熔玻璃和合成β锂霞石填料的复合焊料玻璃制备,以及填料对焊料热膨胀系数(α_C).软化温度(T_f)、封接温度(T_s)和润湿性与流变性能的影响规律;讨论了基质玻璃与填料间复合界面作用;给出了制备热膨胀系数(α_(25~300℃))和T_f分别变化在45~75×10~(-7)/℃和400℃~360℃、兼有较低封接温度和良好润湿性的复合焊料工艺条件和填料的适宜添加量.

 
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