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pcb assembly
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  pcb装配
     A Multi-Agent-Based PCB Assembly Scheduling System
     一个基于多Agent的PCB装配调度系统
短句来源
     Study of Manufacturing Execution System on PCB Assembly
     制造执行系统在PCB装配中的应用研究
短句来源
     A Multiagent-based PCB Assembly Scheduling System
     一个基于多Agent的PCB装配调度系统
短句来源
     The PCB assembly scheduling problem is a Job Shop scheduling problem.
     PCB装配调度问题是一个JobShop调度问题。
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     PCB assembly scheduling is a job shop scheduling problem.
     PCB装配调度是一个jobshop调度问题。
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  pcb组装
     Optimizing PCB Assembly with AOI and SPC
     AOI与SPC的结合使PCB组装最佳化
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     A New Test Challenge Caused by Fine Line PCB Assembly
     对细线PCB组装引起新的测试问题的探讨
短句来源
     Special challenge and packaging test solutions caused by fine line PCB assembly is presented in this article. Some test techniques such as in-circuit test, automated X-ray inspection, and scanning acousic microscopy are briefly stated. Finally, the results show the future of FC and CSP and its test solutions which are evolving to keep pace with the new packaging technology.
     本文论述了细线PCB组装引起的特别挑战和电子封装测试技术方面的改进 ,简要说明了一些测试方法诸如在线测试 (ICT)、自动X射线测试 (AXI)和扫描声学显微镜检测 (SAM ) ,最后表明了现代封装技术 (FC、CSP)及其与之并驾齐驱的封装测试技术的发展前景。
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  “pcb assembly”译为未确定词的双语例句
     Optimal Research on PCB Assembly Planning Based on Genetic Simulated Annealing Algorithm
     基于遗传模拟退火算法的PCB贴装工艺优化研究
短句来源
     Discribe the assembly process of FPC and the difference from PCB assembly.
     以及挠性电路板在表面贴装(SMT)工艺装配流程上与硬板(PCB)不同的工艺装配特点。
短句来源
     The important parameters of GA and SA were designed carefully. For the first time, a genetic simulated annealing algorithm (GSA), which combines the advantages of the GA and SA, was employed to plan PCB assembly.
     然后在改进的遗传算法中融入了模拟退火算法,首次把综合了遗传算法与模拟退火算法优点的遗传模拟退火算法应用于贴装工艺优化,详细设计了算法的关键参数和操作,基于遗传模拟退火算法实现了PCB贴装工艺优化程序,并进行了大量的仿真计算。
短句来源
     During high-density electronic assembly development,BGA is used in PCB assembly widely which area is more and more large and solder balls are increased continuously.
     随着高密度电子组装的发展,BGA的面积越来越大,引脚数不断增加,广泛地应用到PCB的组装中,从而对电子组装工艺提出了更高的要求,特别是对于无铅BGA的返修。
短句来源
     A Optimization Method in the PCB Assembly for Surface Mount-placement Machine Based on Modified Hybrid Genetic Algorithm
     一种基于改进混合遗传算法的贴片机装配工艺优化方法
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  pcb assembly
CPS, a hybrid, which uniquely couples mathematical algorithms with a knowledge base, is a powerful tool in process PCB assembly.
      
The innovation of the methodology is the application of Artificial Intelligence and Expert Systems techniques to represent the human reasoning involved in semi-automated PCB assembly planning.
      
A variant of the classical job grouping problem (JGP) in printed circuit board (PCB) assembly is considered.
      
Grouping PCB Assembly Jobs with Feeders of Several Types
      
In printed circuit board (PCB) assembly, the majority of electronic components are inserted by high-speed placement machines.
      
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Base on the Panasonic HD82 video recoder's PCB assembly,the article analyzed & discussed some problems and key technologies that in the SMT applied in great deal of PCB assembly.The resolve method that it put forward could be reference for the SMT's applied in the practical assembly line.

以松下HD82录象机单板的大规模生产过程为范例,分析探讨了SMT工艺在大规模生产中应该注意的几个问题和工艺要点,并提出了解决方法和应对措施。对SMT技术在实际生产中的应用有一定的参考价值

This paper mainly introduces the practical process to coat with S01-3 Polyaminoresin varnish prevent PCB assembly of unmanned electronic equipment of model So and so ship loaded from moisture,mildew and mist,and comparied with various materials and processes affected to PCB assembly three anti-performance.

介绍了采用S01-3聚氨酯清漆对某型号舰载无人机用电子设备印制电路板组装件进行三防涂覆的实用工艺过程,比较了不同材料和工艺对印制电路板组装件三防性能的影响。

In this paper,a non destructive testing method based on the real time holographic interferometry (RTHI) is used to investigate the dynamic out of plane deformation of a PBGA PCB assembly.The deformation types of the ball shape out of bending and saddle shape warpage under the conditions of the different electronic power heating are found.In addition,the characteristics of the fringe fields of single PBGA and PBGA in a computer mother board are compared and the cause producing different fringe...

In this paper,a non destructive testing method based on the real time holographic interferometry (RTHI) is used to investigate the dynamic out of plane deformation of a PBGA PCB assembly.The deformation types of the ball shape out of bending and saddle shape warpage under the conditions of the different electronic power heating are found.In addition,the characteristics of the fringe fields of single PBGA and PBGA in a computer mother board are compared and the cause producing different fringe fields is analyzed.

90年代以来,表面封装器件(SMD)向高密度化、精密化、薄型化和高集成化方向快速地发展。在研究这些新型电子封装的应力—应变实验技术中,全息干涉测量方法因其高灵敏度、高精度、非接触性、全场分析,可直接获取离面位移等优点而被作为表面安装技术(SMT)可靠性分析的有效方法。本文采用实时全息干涉方法对加电运行中的PBGA器件及外部热辐射条件下PBGA的离面变形进行了测量,得到PBGA呈球面弯曲及马鞍形翘曲变形的实验结果,并初步分析了产生形变差异的原因。

 
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