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solder joint height
相关语句
  焊点高度
     The results indicate that the location of solder joint is the first important factor under shock load and the outmost solder balls of the PBGA experience maximum stresses. The solder joint height, the modulus of BGA and the modulus of PCB have little effect on the stress.
     分析结果表明:在冲击载荷下,焊点位置对焊点应力的影响最大,应力峰值出现在PBGA器件的最外端焊点上,而焊点高度、BGA模量以及PCB模量对焊点应力影响较小.
短句来源
  相似匹配句对
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     The P-Joint Hyperoperation
     P-结合超运算
短句来源
     PROTECT JOINT
     为她的关节撑把保护伞
短句来源
     Analysis of Stand-off Height and Self alignment Effects of Solder Joint in SMT
     SMT焊点间隙和贴片误差自调整作用分析
短句来源
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  solder joint height
The effect of solder joint height on reliability has been widely discussed for BGAs.
      
The variation in the solder joint height and shape does not prevent us from achieving these goals though it does affect our research.
      
Solder paste volume variation is the major reason for our solder joint height and shape variation.
      
It offers an improvement and choice in the solder joint height and shape.
      
Figure 6, it is possible to separate the effect of the different solder joint height and the polymer-bare compliancy.
      
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The thermal cycle lifetim es of Sn Pb solder joints for flip chip package were determined experim entally. With vis- coplastic and viscoelastic materials representing the mechanical behavior of Sn Pb solder and underfill,respectively,the stress/ strain responses of Sn Pb solder joints under thermal cycling with finite element method are simulated.Based on the calculated plastic strain ranges and the experim ental therm al cycle lifetim es,the material constants in Coffin- Manson empirical equation were then...

The thermal cycle lifetim es of Sn Pb solder joints for flip chip package were determined experim entally. With vis- coplastic and viscoelastic materials representing the mechanical behavior of Sn Pb solder and underfill,respectively,the stress/ strain responses of Sn Pb solder joints under thermal cycling with finite element method are simulated.Based on the calculated plastic strain ranges and the experim ental therm al cycle lifetim es,the material constants in Coffin- Manson empirical equation were then obtained.The results show that,the plastic strain ranges of solder joints with underfill decrease distinctly and the thermal cycle lifetim es are approxim ately2 0 times larger than that in the case without underfill.Moreover,the influences of solder joint height on solder joint reliability are weakened for the flip chip package with underfill.

采用实验方法 ,确定了倒装焊 Sn Pb焊点的热循环寿命 .采用粘塑性和粘弹性材料模式描述了 Sn Pb焊料和底充胶的力学行为 ,用有限元方法模拟了 Sn Pb焊点在热循环条件下的应力应变过程 .基于计算的塑性应变范围和实验的热循环寿命 ,确定了倒装焊 Sn Pb焊点热循环失效 Coffin- Manson经验方程的材料参数 .研究表明 ,有底充胶倒装焊 Sn Pb焊点的塑性应变范围比无底充胶时明显减小 ,热循环寿命可提高约 2 0倍 ,充胶后的焊点高度对可靠性的影响变得不明显

In recent years, with the rapid development of microelectronic industries, the reduction of feature size and growth in wafer size will continue in semiconductor industry. There is crucial need for IC packaging to move to higher density, higher performance, smaller, shorter, thinner, lighter in size and lower cost. Flip-chip technology is believed to be necessary to allow speed increase in future generation of IC. Thus, solder joint reliability in the flip-chip technology are getting more important. In the future,...

In recent years, with the rapid development of microelectronic industries, the reduction of feature size and growth in wafer size will continue in semiconductor industry. There is crucial need for IC packaging to move to higher density, higher performance, smaller, shorter, thinner, lighter in size and lower cost. Flip-chip technology is believed to be necessary to allow speed increase in future generation of IC. Thus, solder joint reliability in the flip-chip technology are getting more important. In the future, solder joint reliability research will play an important role. We analyzed the effect of solder joint height and underfill materials on the solder joint strain and stress under thermal loads.

近年来,在微电子工业中,轻、薄、短、小是目前电子封装技术发展的趋势,因此,倒装焊技术应用越来越广,而焊点的可靠性在倒装焊技术中变得越来越重要。采用有限元软件,模拟、分析了焊点高度和下填料对焊点在热载荷作用下的应力应变值。

The dynamic response of PBGA (plastic ball grid array) assembly under high acceleration load was investigated. Through the Analytical calculation and ANSYS simulation, several influencing factors to solder joint stress were studied and parametric analysis was adopted to compare the levels of each factor affecting the stress. The results indicate that the location of solder joint is the first important factor under shock load and the outmost solder balls of the PBGA experience maximum stresses. The solder...

The dynamic response of PBGA (plastic ball grid array) assembly under high acceleration load was investigated. Through the Analytical calculation and ANSYS simulation, several influencing factors to solder joint stress were studied and parametric analysis was adopted to compare the levels of each factor affecting the stress. The results indicate that the location of solder joint is the first important factor under shock load and the outmost solder balls of the PBGA experience maximum stresses. The solder joint height, the modulus of BGA and the modulus of PCB have little effect on the stress. The peak stress can be reduced effectively by increasing the diameter of the solder joints, reducing the modulus of the solder joint materials or choosing a suitable PCB thickness.

从动力学角度分析了PBGA组件在高加速度冲击载荷下的响应.采用解析法与有限元分析相结合的方式考察了PBGA组件的结构参数和材料特性等因素对焊点应力的影响,并运用参量分析法比较了这些因素对焊点应力的影响程度.分析结果表明:在冲击载荷下,焊点位置对焊点应力的影响最大,应力峰值出现在PBGA器件的最外端焊点上,而焊点高度、BGA模量以及PCB模量对焊点应力影响较小.增大焊点直径或减小焊点模量均可有效减小焊点的应力,选择适当的PCB厚度也可降低焊点的应力.

 
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