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   packaging techniques 的翻译结果: 查询用时:0.145秒
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packaging techniques
相关语句
  包装技术
     The Packaging Techniques during the 21th century
     21世纪的包装技术
短句来源
     Preliminary Studies on Packaging Techniques for Plate Glass
     平板玻璃包装技术
短句来源
     Studies on the Rinsing, Browning Controlling and Packaging Techniques of Fresh-cut Vegetables
     鲜切蔬菜清洗、护色和包装技术的研究
短句来源
     This paper discusses the structural design for anti-vibration packaging in the light of the newly developed packaging techniques for instr-umeats in foreign country.
     结合国外新近开发的仪表包装技术,对防振包装结构设计的一般方法作出系统讨论。
短句来源
     The variety of antibacterial food packaging is introduced,and the current trend of antibacterial food packaging techniques both at home and ahroad is also described.
     介绍了抗菌剂的种类 ,并概述了国内、外食品抗菌包装技术的最新研究进展
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  “packaging techniques”译为未确定词的双语例句
     BGA/CSP Packaging Techniques
     BGA/CSP封装技术的研究
短句来源
     TO packaging techniques can achieve a frequency bandwidth of over 10.5 GHz for TO laser module, 15.5 GHz for butterfly laser module and 16.5 GHz for TO photodetector.
     利用此封装技术,实现了3dB调制带宽为10.5GHz的TO封装激光器。
短句来源
     The research and development of these packaging techniques are important to improve infrared detector Dewar assemblies and advance the application of infrared detectors, especially of infrared focal plane arrays.
     这些技术的研究和发展,对提高红外探测器杜瓦组件封装技术水平和推进红外探测器尤其是红外焦平面的应用是至关重要的.
短句来源
     A Study of Structure Design and Packaging Techniques of Si Pressure Sensors
     扩散硅压力传感器结构设计及封装工艺研究
短句来源
     This paper briefly presents some packaging ways of infrared detectors on satellites and mainly describe some critical packaging techniques of infrared detector assembly Dewars.
     本文简要介绍星用红外探测器的一些封装形式,重点阐述了红外探测器杜瓦组件封装的一些关键技术。
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  相似匹配句对
     The Key Techniques of MEMS Packaging
     MEMS封装中的关键技术
短句来源
     Deoxidation Packaging and Its Applied Techniques
     除氧包装及其应用技术
短句来源
     Packaging News
     包装信息
短句来源
     ENCRYPTION TECHNIQUES
     加密技术
短句来源
     On Packaging Theory
     包装学理论初探
短句来源
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  packaging techniques
The results obtained using both methods show that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of 22 GHz.
      
Based on the analysis, the potential bandwidth of TO packaging techniques is estimated from the scattering parameters of the TO packaging network.
      
Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules
      
It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.
      
Frequency Bandwidth Estimation of TO Packaging Techniques for Laser Modules
      
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In this paper,the coupling single mode fibres to strip waveguides and packaging techniques are reviewed.An improved “inversionchip” coupling method was used in the coupling experiments.We have achieved the fibre-coupled Ti: LiNbO_3 waveguide phase modulators with total fibre/device (2cm length wave- guide)/fibre insertion loss below 7dB.The developmental direction of coupling technology was described.

本文对单模光纤与条形波导的耦合封装技术进行了评述。使用改进后的“倒装”耦合技术进行了耦合实验,完成了单模光纤耦合 Ti:LiNbO_3波导相位调制器的封装,达到了光纤/器件(2厘米长波导)/光纤总插入损耗小于5dB。同时,阐述了耦合技术的发展方向。

The core of the antivibration packaging design lies in the regulation of the transferrate of the antivibration gasket for controlling the resonance response of the key andvulnerable parts. The prerequisite is to establish vibration environmental data bank andantivibration materials data bank. This paper discusses the structural design for anti-vibration packaging in the light of the newly developed packaging techniques for instr-umeats in foreign country.

防振包装设计的核心在于调节防振衬垫的传送率来控制关键易损零件的共振响应。前提是建设振动环境数据率和防振材料数据率。本文从基本的振动模型出发.结合国外新近开发的仪表包装技术,对防振包装结构设计的一般方法作出系统讨论。

The products made by this machine cam deal with the packaging for highgradegoods,not only fitting the requirements for packaging techniques,the performance andindex, but also beautifying the goods, thus it enhances the economic benifits.

介绍新近研制成功的层复机的原理、构造和性能等。该机生产的产品能解决高层次物件的包装,即达到包装技术、性能、指标的要求,又美化了物件,同时提高了经济效益。

 
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