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normal solidification
相关语句
  常规凝固
     Normal Solidification of Ni-Al Series Binary Peritectic Alloys
     Ni-Al系包晶合金的常规凝固
短句来源
     The morphologies of Frank-Kasper phase in Al_xMg_(40)Zn_(60-x)(x=2045,mole fraction) alloys subjected to normal solidification were studied by using optical microscope,X-ray diffraction and scanning electronic microscope.
     研究了在常规凝固条件下化学成分为AlxMg40Zn60-x(x=20~45,摩尔分数)合金中Frank-Kasper相的组织形貌。
短句来源
  “normal solidification”译为未确定词的双语例句
     THE EFFECT OF NATURAL CONVECTION ON THE SOLUTE DISTRIBUTION IN HORIZONTAL NORMAL SOLIDIFICATION
     水平正态凝固时自然对流对溶质分布的影响
短句来源
     OCr in-situ composites wire were discussed. The properties of microstructure characteristics , morphology evolution and mechanism of two phases growth in the normal solidification samples and continuous casting samples were researched and compared, by means of optical microscope(OM), Scanning Electron Microscopy (SEM) , X-ray Diffraction (XRD) and image analysis technique etc, and relationship of parameters and microstructure was established.
     利用光学显微镜(OM)、扫描电镜(SEM)、X射线衍射(XRD)、图像分析技术等多种分析测试手段,考察并对比了体积凝固(退火态)与连铸态试样的组织形貌特征、演变过程以及两相生长机制的多方面的凝固特性,并且明确凝固参数与凝固组织的对应关系;
短句来源
     Three kinds of normal solidification Ni-Al series binary peritectic alloys were prepared by electric arc smelting with Ar protection.
     选取了Ni Al系 3种成分的包晶合金 ,采用氩气保护电弧熔炼的方法得到试样。
短句来源
     The results show that the normal solidification process is restrained,and the eutectic reaction is replaced by the liquid phase separation reaction when Ti element was added under arc melting.
     结果表明:在电弧熔炼条件下,加入合金元素Ti,合金正常凝固的过程得到抑制,凝固后期的共晶反应被液相分解反应取代;
短句来源
  相似匹配句对
     Application of the Normal Temperature Solidification Fluorocarbon Resin Coating
     常温固化氟碳树脂涂料在清水混凝土的应用
短句来源
     5 as normal.
     5=正常肌力。
短句来源
     THE EFFECT OF THE NORMAL MOTION ON THE SOLIDIFICATION OF ~4He PHYSISORBED MONOLAYER
     法向运动对氦吸附层凝固的影响
短句来源
     Then F is normal in D.
     则F在区域D上正规.
短句来源
     INTERFACE DURING SOLIDIFICATION
     凝固层界面上局部对流换热系数的确定
短句来源
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  normal solidification
Moreover, it was found that under normal solidification conditions, secondary nucleation of fine grains can occur near the center of a cylindrical cast iron specimen.
      
Owing to the lack of diffusion of W in the solid phases, undercooling is observed at normal solidification rates.
      
Owing to the lack of diffusion of W in the solid phases, undercooling is observed at normal solidification rates.
      
This rejection is a normal solidification phenomenon but has never been photographed before m a metal alloy.
      


The carbides of MC formed during solidification of Ni-base sup-eralloys exist in the form of blocky or Chinese-script type morphology.Experiments show that both initial morphology in normal solidification conditionand final morphology near equilibrium condition are octahedral blocks.Thetheoretical form of MC carbide growing from superalloy melt is considered asoctahedral shape enclosed by {111} faces according to analysis of PBC(PeriodicBond Chain)theory.It has also inferred that one of growth units of...

The carbides of MC formed during solidification of Ni-base sup-eralloys exist in the form of blocky or Chinese-script type morphology.Experiments show that both initial morphology in normal solidification conditionand final morphology near equilibrium condition are octahedral blocks.Thetheoretical form of MC carbide growing from superalloy melt is considered asoctahedral shape enclosed by {111} faces according to analysis of PBC(PeriodicBond Chain)theory.It has also inferred that one of growth units of MC carbidemay be octahedral molecule consisting of a metal atom su(?)ounded by six carbonatoms.The stack sketch of these growth units is layer growth mechanisms on{111} faces,which is verified by observation of SEM after ion bombarding forthe surface of Mc carbide.

本文应用 PBC 理论证实了 MC 碳化物从 Ni 基高温合金熔体中生长的理想形貌是以{111}面为外表面的八面体.认为 MC 的一种生长基元为由金属原子和周围六个碳原子组成的八面体配位体,在近平衡条件下MC 碳化物的晶体生长机制是该配位体沿晶体的{111}面层状生长.

Interfacial morphology undergoes a non-steady state evolution process before steady state. This process shows different features under different solidification conditions. The development of interfacial morphology of normal solidification (low growth rate) has been well studied by many researchers[1-3]. But up to now, no experimental research report on the morphological evolution in sub-rapid solidification has been found in the open literature.In present paper, the directional solidification...

Interfacial morphology undergoes a non-steady state evolution process before steady state. This process shows different features under different solidification conditions. The development of interfacial morphology of normal solidification (low growth rate) has been well studied by many researchers[1-3]. But up to now, no experimental research report on the morphological evolution in sub-rapid solidification has been found in the open literature.In present paper, the directional solidification experiments have been carried out in a transparant carbon-tetrabromide system in-situ for studying the non-steady evolution of interfacial morphology in a wide range of growth rate. Fig 1 (a~d) show the non-steady evolution characteristics of primary spacing λ1 and tip radius R of the typical cell (a) and dcndrite (c) array at low growth rate and cell (b)and dcndritc (d) array at high groWth rate respectively. Symbol E in Fig.1 represents the model of elimination through competition and symbol S represents the model of tip splitting. Fig.2 demonstrates the dynamic evolution morphologics corresponding to Fig.1. The results show that: (1) at low growth rate, the spacing of normal cellular array is adjusted and dominated altCrnatcly by models E and S and both the cell spacing and tip radius appear to vary more or less irregularly (Fig.1 a); (2) in sub-rapid solidification, the adjustment is dominated by model S only over the whole of evolution process, and λ1 decreases monotonically with time (Fig. 1b); (3) at low growth rate, the evolving character of dendrite array is always adjUsted by model E over the whole process (Fig.Zc). which leads to monotonic ir-se of bland monotonic dccrcasc of R (Fig.lc); and (4) in sub-rapid solidification,when is higher than gs, the dendrite evolution is dominated by model S and violent tip-splitting causes a sharp decrease in λ1(Fig. 1d).The results show that the evolution features of sub-rapid solidification are quite different from those of normal solidification. The increase of primary spacing of dendritc array with time at low growth rate implies the development of side-branching instability. But at rapid growth rate the dcndrite primary spacing is decreased through tip-splitting, which indicates the development of iii) instability. It illustrates that the growth rate exerts a significant effect on the evolution ofinterfacial morphology.

低速凝固与亚快速凝固界面非稳态演化规律实验研究王祖锦,傅恒志凝固过程界面达到稳态之前,界面形态的演化是时间相关的非稳态过程,在不同的凝固条件下,这种非稳态过程表现出不同的演化规律.人们对低速凝固界面形态的非稳态演化规律已有不少实验研知卜斗但对于亚快速...

The solidifies characterization of rare earth rich phase in slowly and rapidly cooled Ti 55 alloy was observed and analyzed. After the ingot of Ti 55 alloy solidifies slowly, the rare earth rich phase particles are uniformly distributed in the coarse dendritical matrix within normal solidification zone. However, for the shrinkage area, lots of aggregated particles appear in the initial shrinkage zone, in addition, the particles in the normal shrinkage zone formed bands and are aligned parallel...

The solidifies characterization of rare earth rich phase in slowly and rapidly cooled Ti 55 alloy was observed and analyzed. After the ingot of Ti 55 alloy solidifies slowly, the rare earth rich phase particles are uniformly distributed in the coarse dendritical matrix within normal solidification zone. However, for the shrinkage area, lots of aggregated particles appear in the initial shrinkage zone, in addition, the particles in the normal shrinkage zone formed bands and are aligned parallel to the advancing solidification front. Rapid solidification produces fine rare earth rich phase particles, of which some particles are uniformly distributed in the α Ti matrix, others are lined up to be rows of band. The reason for the formation of the band both in the ingot riser area and in the rapid solidification flakes is that the advancing liquid solid interface remains planar.

Ti55 高温钛合金在缓冷(1000 kg 铸锭冒口) 条件下, 正常凝固区中稀土相呈弥散分布状态,初始补缩区中稀土相聚集成团, 正常补缩区中稀土相颗粒沿平行于凝固界面方向规则排列; 在快冷( 锤砧薄片) 条件下, 稀土相除弥散分布在合金中外, 出现稀土相颗粒排列成行的现象。两种凝固条件下均出现颗粒规则排列现象的原因是凝固界面的平面长大。

 
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