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   润湿角 在 无线电电子学 分类中 的翻译结果: 查询用时:0.017秒
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润湿角
相关语句
  wetting angle
    On tin-plated copper substrate,the best wettability(the wetting angle is 12°) can be got when organic halide and inorganic halide activated rosin flux(No.6 flux) are matched with Sn-9Zn solder,close to the wettability of Sn-37Pb solder.
    在镀锡铜片上,有机卤化物+无机卤化物活性剂松香焊剂(#6焊剂)匹配Sn-9Zn焊料获得最佳的润湿性(润湿角为12°),接近Sn-37Pb焊料的润湿性。
短句来源
    As a result,on tin-plated copper substrate,inorganic halide activator rosin flux(No.5 flux) matching Sn-0.75 Cu solder can get the best wettability(the wetting angle is 18°),close to the wettability of Sn-37 Pb.
    在镀锡铜片上,5#焊剂匹配Sn-0.75Cu焊料能够获得最佳的润湿性(润湿角为18°),已接近Sn-37Pb焊料的润湿性。
短句来源
    The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model.
    通过建立简化的数学模型,得出了润湿角与钎料熔滴铺展面积间的数学关系式。
短句来源
  “润湿角”译为未确定词的双语例句
    A lot of testing results have been analysed by the author and it is believed that data obtained by means of laser/infrared testing, such as wet angle, outter appearence, tension resistance, weight of soldering material and thickness of alloy layer, may be used as critera for the acceptance of soldering points.
    笔者对大量试验结果进行分析,可以认为:焊点激光红外检测数据、润湿角大小、焊点外形及抗拉强度数值、焊料重量值和合金层,可以作为判断焊点合格与否的标准。
短句来源
  相似匹配句对
    The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model.
    通过建立简化的数学模型,得出了润湿与钎料熔滴铺展面积间的数学关系式。
短句来源
    An Approachto Codes of Axis Angles
    浅析轴编码
短句来源
    LOSS TANGENT OF THIN FERROELECTRIC CRYSTAL ELEMENTS
    铁电薄片的损耗正切
短句来源
    As a result,on tin-plated copper substrate,inorganic halide activator rosin flux(No.5 flux) matching Sn-0.75 Cu solder can get the best wettability(the wetting angle is 18°),close to the wettability of Sn-37 Pb.
    在镀锡铜片上,5#焊剂匹配Sn-0.75Cu焊料能够获得最佳的润湿性(润湿为18°),已接近Sn-37Pb焊料的润湿性。
短句来源
    Study on Dispenser of Liquid Droplets Based on Electrowetting-on-Dielectric
    基于介质上电润湿的液滴产生器的研究
短句来源
查询“润湿角”译词为用户自定义的双语例句

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  wetting angle
The calculations are made in the range of variation of the parameters, the wetting angle and the Bond number, adjoining the boundary of the stability region.
      
For fixed volume of the fluid and different values of the angular velocity and the wetting angle the decay rate and frequency of the characteristic oscillations are calculated.
      
A nonuniform temperature distribution, the presence of surface-active substances and impurities, and also other factors lead to a change in the wetting angle along a plane.
      
The Effect of Wave Formation and Wetting Angle on the Thermocapillary Breakdown of a Falling Liquid Film
      
Different working liquids and coatings of the working surface are used in the experiments to investigate the effect of the wetting angle on the film breakdown.
      
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Testing system using laser/infrared for soldering points in PCB's is the most advanced soldering points testing system appeared in the world in mid 1980's. It is uncomparable with regard to testing speed, accuracy, reliability and degree of automation and far better than any other means of testing such as visual observation. A lot of testing results have been analysed by the author and it is believed that data obtained by means of laser/infrared testing, such as wet angle, outter appearence, tension resistance,...

Testing system using laser/infrared for soldering points in PCB's is the most advanced soldering points testing system appeared in the world in mid 1980's. It is uncomparable with regard to testing speed, accuracy, reliability and degree of automation and far better than any other means of testing such as visual observation. A lot of testing results have been analysed by the author and it is believed that data obtained by means of laser/infrared testing, such as wet angle, outter appearence, tension resistance, weight of soldering material and thickness of alloy layer, may be used as critera for the acceptance of soldering points.

激光/红外印制电路板焊点检测系统,是80年代中期出现的世界上最先进的焊点质量检测手段,其检测速度、检测精度、检测可靠性和重复性、自动化程度,都是人工目视等其它方法远远不可比拟的。笔者对大量试验结果进行分析,可以认为:焊点激光红外检测数据、润湿角大小、焊点外形及抗拉强度数值、焊料重量值和合金层,可以作为判断焊点合格与否的标准。

The solderability of electronic solders and some factors that influence the solderability are discussed. The solderability depends, to a great extent, on the wettability, which is related with solid, liquid and gas interfacial tensions of the melted solders on substrates. The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model. The solderability of the solder based on Sn-Zn-Ag was evaluate by the test method of spreading areas. The results...

The solderability of electronic solders and some factors that influence the solderability are discussed. The solderability depends, to a great extent, on the wettability, which is related with solid, liquid and gas interfacial tensions of the melted solders on substrates. The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model. The solderability of the solder based on Sn-Zn-Ag was evaluate by the test method of spreading areas. The results indicated that the solderability of the solder has been improved by adding Zn.

讨论了电子软钎料的钎焊性能及其影响因素,钎料的钎焊性能很大程度取决于钎料对基板的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面张力有关。通过建立简化的数学模型,得出了润湿角与钎料熔滴铺展面积间的数学关系式。文中采用铺展面积法对Sn-Ag-Bi系钎料钎焊性能进行评估,结果表明在添加少量的Zn,可在一定程度上提高钎料的润湿性能,并可减少Bi的用量。

In order to solve the poor wettability of lead-free solder,halide activated rosin fluxes were adopted.And the wettability of Sn-9Zn solder was investigated.The influencing factors of the wettability were analysed and discussed.On tin-plated copper substrate,the best wettability(the wetting angle is 12°) can be got when organic halide and inorganic halide activated rosin flux(No.6 flux) are matched with Sn-9Zn solder,close to the wettability of Sn-37Pb solder.

为解决无铅焊料润湿性差的问题,采用卤化物活性剂松香焊剂,通过实验研究了Sn-9Zn焊料的润湿性。分析讨论了影响Sn-9Zn焊料润湿性的因素,获得了最佳匹配。在镀锡铜片上,有机卤化物+无机卤化物活性剂松香焊剂(#6焊剂)匹配Sn-9Zn焊料获得最佳的润湿性(润湿角为12°),接近Sn-37Pb焊料的润湿性。

 
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