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机械磨
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  mechanical mill
     Application of mechanical mill for aluminium hydrate smashing
     机械磨在氢氧化铝粉碎中的应用
短句来源
     The paper compares mechanical mill with the other kinds of smashing equipments in the producing process of filling aluminium hydrate,and points out that mechanical mill is not noly sure that the quality of aluminium hydrate is qualified,but also has advantages of high output and low consumption,so it should be used widely.
     本文就机械磨生产氢氧化铝填料,与其它两种粉碎设备进行了比较,并指出机械磨不仅能保证产品质量,而且具有产量高、能耗低的优点,应大力推广应用。
短句来源
  mechanical grinding
     Research and Development of Automatic Detecting Device for Mechanical Grinding Process
     机械磨加工自动检测装置的研制
短句来源
  “机械磨”译为未确定词的双语例句
     P - RC APMP ( preconditioning refining chemical alkaline hydrogen peroxide mechanical pulp) enjoys the following advantages: technological flexibility, lower chemical consumption, better physical optical properties, higher yield and lower pollution.
     P-RC APMP(Preconditioning Refining Chemical APMP),即盘磨化学预处理碱性过氧化氢机械磨木浆,具有工艺灵活、药品消耗低、浆料的光学性能好、得率高、污染小等优点。
短句来源
     Results: The resin tag length of the group of mechanically removing outmost layer of prismless enamel was 51.33±12.36μm; the group of cleaning with cup-shaped brush was 39.72±11.69μm; the group of not treating with both methods was 25.57±8.18μm.
     结果 :机械磨除釉质表层组树脂突长度为 5 1.33± 12 .36 μm ,杯刷刷洗组 39.72± 11.6 9μm ,既未机械磨除表层 ,又未用杯刷刷洗组为 2 5 .5 7± 8.18μm ,统计学检验有显著性差异。
短句来源
     This paper has investigated the technological problems such as the removing In 2O 3 film lager and thinning and polishing the InSb sensitive film lager by means of mechanical abrading and polishing during the preparation of the InSb thin film and introduced a novel abrading and polishing processing.
     】在InSb薄膜制备过程中,用机械磨抛的方法,探索了In2O3氧化膜的去除和InSb敏感膜层的减薄、抛光等技术问题,从而提出一种新型磨抛工艺。
短句来源
     Conclusion: The result indicates that a thin surface(100 μm ) of the cast titanium crown should be removed before firing of the porcelain.
     结论 :采用机械磨除及喷沙的方法可以基本消除铸钛表面的反应层对铸钛与瓷结合性能的影响 ,提示铸造纯钛冠桥基底在附瓷以前应磨除表面厚约 10 0 μm的反应层 ,以利于钛瓷之间形成较强的结合力。
短句来源
     Effects of Polyvinylamines(PVAm) on drainage and retention of wood mechanical pulp and reed chemical pulp added with CaCO3 were investigated under neutrai papermaking condition.
     本研究主要探讨了在弱碱性条件下聚乙烯胺(PVAm)对CaCO3加填的马尾松机械磨木浆(机械浆)和漂白芦苇化学浆(芦苇浆)的助滤、助留效果。
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  相似匹配句对
     Application of mechanical mill for aluminium hydrate smashing
     机械在氢氧化铝粉碎中的应用
短句来源
     Preparing Al-Pb alloy by mechanical milling
     机械制备Al-Pb合金
短句来源
     and mechanical exfoliation.
     机械剥蚀。
短句来源
     Software Machinery
     软件机械
短句来源
     Form grinding of a gear
     齿轮成形
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  mechanical mill
In this first report on this novel mechanical mill, several variables, including the milling time and powder charge and their effects on the microstructural evolution of powder particles, are monitored and studied.
      
  mechanical grinding
The corrosion behavior of highly dispersed iron powders obtained by mechanical grinding in a solution of triethoxy(vinyl)silane (0.3 wt %) in heptane was studied in 0.85% NaCl at 3°C.
      
Long-range effects of ion irradiation, chemical etching, and mechanical grinding on relaxation of a solid solution of iron in ga
      
Long-range effects of ion irradiation with argon, chemical etching, or mechanical grinding on the A and B centers are observed.
      
The occurrence of a solid-phase reaction between powders of the fullerite C60 and potassium halides under the conditions of mechanical grinding is established.
      
% during mechanical grinding in a planetary ball mill have been studied using X-ray diffraction, M?ssbauer spectroscopy, and magnetic measurements.
      
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It is well known that Austenite-Bainite Spheroidal graphite cast iron has a high strength and toughness.The authors have successfully prepared the films of spheroidal cast iron for TEM by cutting it into slices at a low speed,milling it mechanically and ion-thinning it at a low angle finally.Electron diffraction and corresponding diffraction contirast image show that the morphology of sphe roidal graphite cast iron which was austenitized at 900℃ for 1 hour and auste-mpered between 370℃and 3801 for 1.5 hours...

It is well known that Austenite-Bainite Spheroidal graphite cast iron has a high strength and toughness.The authors have successfully prepared the films of spheroidal cast iron for TEM by cutting it into slices at a low speed,milling it mechanically and ion-thinning it at a low angle finally.Electron diffraction and corresponding diffraction contirast image show that the morphology of sphe roidal graphite cast iron which was austenitized at 900℃ for 1 hour and auste-mpered between 370℃and 3801 for 1.5 hours by salt bath is bainite-ferritic lath between which there is residual austenite.The cementite was not observed.The quantity of retained austenite is about 30% in the total volume by X-ray determination.

奥-贝球墨铸铁具有良好的综合性能。作者采用低速切割、机械磨抛和最终的低角度离子减薄的方法成功地制备了供透射电镜观察用的球铁薄膜,电子衍射和相应的衍射像表明,球铁经900℃奥氏体化一小时,并于370—380℃盐浴中等温一小时三十分后,其形态为板条状贝氏体铁素体,其间有奥氏体,未发现渗碳体存在,经X射线衍射测定残留奥氏体量为30%。

An analysis on the mechanism of ceramic grinding with diamond wheel and Electro discharge-machining(EDM) has been car ried out. Proposes the electro discharge mechanical-grinding(EDMG) which combines the virtues of both EDM and grinding. It can be used in machining ceramics with high efficiency and quality. The experi mental results show that the efficiency of EDMG is 3 times as high as that of grinding, and the surface integrity is close to that of grinding.

对陶瓷材料的金刚石砂轮磨削加工和放电加工机理进行了研究,并提出了机械磨—放电复合加工技术。由于该复合加工技术有效地结合了放电加工和机械磨削加工的特点,并且二者互为有利条件,因而能高效率、高质量地加工陶瓷材料。实验结果表明,该复合加工技术的加工效率是机械磨削加工的3倍左右,并且加工表面质量与机械磨削相近。

A new method for observation of wafer surface damage──electrochemical etch method is presented and is of a successful use for polished CMT wafer surface damage。 Mechanical scratches induced during polishing wa-fers are directly observed after electrochemical etch.Maximum damage depth of lapped wafers with W3.5 abrasive grain is about 32~40μm. The meehanical scratches produce stress tunnel in crystal which is the most important damage.Average damage depth will dominate surface recombination vefocity of carriers...

A new method for observation of wafer surface damage──electrochemical etch method is presented and is of a successful use for polished CMT wafer surface damage。 Mechanical scratches induced during polishing wa-fers are directly observed after electrochemical etch.Maximum damage depth of lapped wafers with W3.5 abrasive grain is about 32~40μm. The meehanical scratches produce stress tunnel in crystal which is the most important damage.Average damage depth will dominate surface recombination vefocity of carriers and maximun damage affects performances of sensitive elements ofdetector. So it knecessary to control maximum damage depth.

本文报道一种新的观察碲镉汞(CMT)晶片表面加工损伤的方法──电化学腐蚀法。文中讨论了电化学腐蚀法的原理,给出了实验结果。实验表明:机械磨抛的CMT晶片表面的加工损伤可用电化学腐蚀法清楚地揭示出来;磨抛产生的机械划痕在电化学腐蚀前后一一对应,而且腐蚀后可清晰、直观地看到腐蚀前看不见的机械划痕;结合化学腐蚀的方法测量了一定磨抛条件下W3.5磨料在CMT晶片表面产生的最大加工损伤深度约32~40pm;机械磨抛产生的划痕和其在表面留下的应力沟道区是CMT晶片表面在磨抛加工中受到损伤的主要机构。分析认为平均损伤深度主要影响磨抛CMT晶片的表面复合速度,而最大加工损伤深度则对CMT器件、特别是多元器件性能参数的均匀性影响比较大;故控制好CMT晶片表面加工的最大损伤深度也是制备性能均匀的CMT多元探测器的一个重要环节。

 
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